SLVAFA9 March   2022 TPS82130 , TPSM82903

 

  1.   Trademarks
  2. 1Introduction
  3. 2Power Density
  4. 3Achieving a Smaller Solution
    1. 3.1 Fewer External Components
    2. 3.2 Smart Configuration Pin
    3. 3.3 VSET
  5. 4Reducing Power Loss
    1. 4.1 Junction Temperature
    2. 4.2 Automatic Efficiency Enhancement (AEE™)
    3. 4.3 Switching Frequencies and FET RDS(ON)
    4. 4.4 Auto PFM/PWM vs. Forced PWM
  6. 5Application Flexibility
    1. 5.1 Quiescent Current
    2. 5.2 Lower and More Accurate Output Voltages
    3. 5.3 Capacitive Discharge
  7. 6Summary
  8. 7References

3.1 Fewer External Components

Both devices uses a small 3.0 mm × 2.8 mm MicroSiPTM package, however the size of the package is not the only thing that reduces the application size. External components also has important factor on both the cost and the area of the application. TPSM8290x has decreased the passives needed to configure the device. For 1.2 Vo application for example, there is no need to use external feedback resistors, VSET can be grounded. Also the soft start capacitor is not required (Optional), that can save an additional component. The result saves precious board space, BOM costs and design time.



Figure 3-1 Typical Application Schematic of the TPSM82903


Figure 3-2 Typical Application Schematic of the TPS82130