SLVS238L August   1999  – November 2024 TL331 , TL331B , TL391B

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
    1.     Pin Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings, TL331 and TL331K
    2. 5.2  Absolute Maximum Ratings, TL331B and TL391B
    3. 5.3  ESD Ratings - TL331B and TL391B
    4. 5.4  ESD Ratings, TL331 and TL331K
    5. 5.5  Recommended Operating Conditions, TL331B and TL391B
    6. 5.6  Recommended Operating Conditions, TL331 and TL331K
    7. 5.7  Thermal Information
    8. 5.8  Electrical Characteristics, TL331B and TL391B
    9. 5.9  Switching Characteristics, TL331B and TL391B
    10. 5.10 Electrical Characteristics, TL331 and TL331K
    11. 5.11 Switching Characteristics, TL331 and TL331K
    12. 5.12 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
    4. 6.4 Device Functional Modes
      1. 6.4.1 Voltage Comparison
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Input Voltage Range
        2. 7.2.2.2 Minimum Overdrive Voltage
        3. 7.2.2.3 Output and Drive Current
        4. 7.2.2.4 Response Time
      3. 7.2.3 Application Curves
      4. 7.2.4 ESD Protection
      5. 7.2.5 Power Supply Recommendations
      6. 7.2.6 Layout
        1. 7.2.6.1 Layout Guidelines
        2. 7.2.6.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

5.7 Thermal Information

THERMAL METRIC(1)TL331x, TL391xUNIT
DBV (SOT-23)
5 PINS
RθJAJunction-to-ambient thermal resistance211.7°C/W
RθJC(top)Junction-to-case (top) thermal resistance133.6°C/W
RθJBJunction-to-board thermal resistance79.9°C/W
ψJTJunction-to-top characterization parameter56.4°C/W
ψJBJunction-to-board characterization parameter79.6°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics report.