SLVS930C December   2009  – October 2020 TPS2560 , TPS2561

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 ESD Ratings: Surge
    4. 7.4 Recommended Operating Conditions
    5. 7.5 Thermal Information
    6. 7.6 Electrical Characteristics
    7. 7.7 Dissipation Ratings
    8. 7.8 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Overcurrent Conditions
      2. 9.3.2 FAULTx Response
      3. 9.3.3 Undervoltage Lockout (UVLO)
      4. 9.3.4 Enable ( ENx or ENx)
      5. 9.3.5 Thermal Sense
    4. 9.4 Device Functional Modes
  10. 10Power Supply Recommendations
    1. 10.1 Self-Powered and Bus-Powered Hubs
    2. 10.2 Low-Power Bus-Powered and High-Power Bus-Powered Functions
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Power Dissipation
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

7.6 Electrical Characteristics

over recommended operating conditions, V/ENx = 0 V, or VENx = VIN (unless otherwise noted)
PARAMETERTEST CONDITIONS(1)MINTYPMAXUNIT
POWER SWITCH
rDS(on)Static drain-source on-state resistance per channel, IN to OUTxTJ = 25 °C4450mΩ
–40 °C ≤ TJ ≤ 125 °C70
trRise time, outputCLx = 1 μF, RLx = 100 Ω
(see Figure 8-1)		VIN = 6.5 V234ms
VIN = 2.5 V123
tfFall time, outputCLx = 1 μF, RLx = 100 Ω
(see Figure 8-1)		VIN = 6.5 V0.60.81.0ms
VIN = 2.5 V0.40.60.8
ENABLE INPUT, EN OR EN
Enable pin turn on/off threshold0.661.1V
Hysteresis55(2)mV
IENInput currentVENx = 0 V or 6.5 V, V/ENx = 0 V or 6.5 V–0.50.5μA
tonTurnon timeCLx = 1 μF, RLx = 100 Ω, (see Figure 8-1)9ms
toffTurnoff time6ms
CURRENT LIMIT
IOSCurrent-limit threshold per channel (Maximum DC output current IOUTx delivered to load) and Short-circuit current, OUTx connected to GNDRILIM = 20 kΩ259028003005mA
RILIM = 61.9 kΩ8009001005
RILIM = 100 kΩ470560645
tIOSResponse time to short circuitVIN = 5.0 V, (see Figure 8-2)3.5(2)μs
SUPPLY CURRENT
IIN_offSupply current, low-level outputVIN = 6.5 V, no load on OUTx, V ENx = 6.5 V or VENx = 0 V0.12.0μA
IIN_onSupply current, high-level outputVIN = 6.5 V, no load on OUTRILIM = 20 kΩ100125μA
RILIM = 100 kΩ85110μA
IREVReverse leakage currentVOUTx = 6.5 V, VIN = 0 VTJ = 25°C0.011.0μA
UNDERVOLTAGE LOCKOUT
UVLOLow-level input voltage, INVIN rising2.352.45V
Hysteresis, INTJ = 25°C35mV
FAULTx FLAG
VOLOutput low voltage, FAULTxIFAULTx = 1 mA180mV
Off-state leakageVFAULTx = 6.5 V1μA
FAULTx deglitchFAULTx assertion or de-assertion due to overcurrent condition6913ms
THERMAL SHUTDOWN
OTSD2Thermal shutdown threshold155°C
OTSDThermal shutdown threshold in current-limit135°C
Hysteresis20(2)°C
(1) Pulse-testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into account separately.
(2) These parameters are provided for reference only, and do not constitute part of TI's published specifications for purposes of TI's product warranty.