SLVS930C December   2009  – October 2020 TPS2560 , TPS2561

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 ESD Ratings: Surge
    4. 7.4 Recommended Operating Conditions
    5. 7.5 Thermal Information
    6. 7.6 Electrical Characteristics
    7. 7.7 Dissipation Ratings
    8. 7.8 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Overcurrent Conditions
      2. 9.3.2 FAULTx Response
      3. 9.3.3 Undervoltage Lockout (UVLO)
      4. 9.3.4 Enable ( ENx or ENx)
      5. 9.3.5 Thermal Sense
    4. 9.4 Device Functional Modes
  10. 10Power Supply Recommendations
    1. 10.1 Self-Powered and Bus-Powered Hubs
    2. 10.2 Low-Power Bus-Powered and High-Power Bus-Powered Functions
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Power Dissipation
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

7.5 Thermal Information

THERMAL METRIC(1)TPS256xUNIT
DRC (VSON)
10 PINS
RθJAJunction-to-ambient thermal resistance47.8°C/W
RθJC(top)Junction-to-case (top) thermal resistance66.2°C/W
RθJBJunction-to-board thermal resistance22.4°C/W
ψJTJunction-to-top characterization parameter1.6°C/W
ψJBJunction-to-board characterization parameter22.6°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance4.9°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.