SLVSB69C June   2012  – September 2021 TPS54719

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Fixed Frequency PWM Control
      2. 7.3.2 Slope Compensation And Output Current
      3. 7.3.3 Bootstrap Voltage (Boot) And Low Dropout Operation
      4. 7.3.4 Error Amplifier
      5. 7.3.5 Voltage Reference
      6. 7.3.6 Adjusting The Output Voltage
      7. 7.3.7 Enable and Adjusting Undervoltage Lockout
      8. 7.3.8 Slow Start/Tracking Pin
      9. 7.3.9 Sequencing
    4. 7.4 Device Functional Modes
      1. 7.4.1  Constant Switching Frequency And Timing Resistor (RT Pin)
      2. 7.4.2  Overcurrent Protection
      3. 7.4.3  Frequency Shift
      4. 7.4.4  Reverse Overcurrent Protection
      5. 7.4.5  Power Good (PWRGD Pin)
      6. 7.4.6  Overvoltage Transient Protection
      7. 7.4.7  Thermal Shutdown
      8. 7.4.8  Small Signal Model For Loop Response
      9. 7.4.9  Simple Small Signal Model For Peak Current Mode Control
      10. 7.4.10 Small Signal Model For Frequency Compensation
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 High Frequency, 1.8-V Output Power Supply Design With Adjusted UVLO
      2. 8.2.2 Design Requirements
      3. 8.2.3 Detailed Design Procedure
        1. 8.2.3.1 Selecting The Switching Frequency
        2. 8.2.3.2 Output Inductor Selection
        3. 8.2.3.3 Output Capacitor
        4. 8.2.3.4 Input Capacitor
        5. 8.2.3.5 Slow-Start Capacitor
        6. 8.2.3.6 Bootstrap Capacitor Selection
        7. 8.2.3.7 Undervoltage Lockout Set Point
        8. 8.2.3.8 Output Voltage And Feedback Resistors Selection
        9. 8.2.3.9 Compensation
      4. 8.2.4 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
      1. 10.2.1 Power Dissipation Estimate
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

6.4 Thermal Information

THERMAL METRIC(1)TPS54719UNITS
RTE (16 PINS)
RθJAJunction-to-ambient thermal resistance (standard board)49.1°C/W
RθJAJunction-to-ambient thermal resistance (custom board)(2)37.0
ψJTJunction-to-top characterization parameter0.7
ψJBJunction-to-board characterization parameter21.8
RθJC(top)Junction-to-case(top) thermal resistance50.7
RθJC(bot)Junction-to-case(bottom) thermal resistance7.5
RθJBJunction-to-board thermal resistance21.8
(1) Power rating at a specific ambient temperature TA should be determined with a junction temperature of 140°C. This is the point where distortion starts to substantially increase. See power dissipation estimate in the application section of this data sheet for more information.
(2) Test boards conditions:
  1. 2 inches x 2 inches, 4 layers, thickness: 0.062 inch
  2. 2 oz. copper traces located on the top of the PCB
  3. 2 oz. copper ground planes on the 2 internal layers and bottom layer
  4. 4 thermal vias (10mil) located under the device package