SLVSDO5F July   2017  – December 2021 TPS22916

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
      1. 6.7.1 Typical Electrical Characteristics
      2. 6.7.2 Typical Switching Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 On and Off Control
      2. 8.3.2 Fall Time (tFALL) and Quick Output Discharge (QOD)
      3. 8.3.3 Full-Time Reverse Current Blocking
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Maximum Inrush Current
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Tape and Reel Information

Revision History

Changes from Revision E (September 2020) to Revision F (December 2021)

  • Added TPS22916CNL and TPS22916BL orderables to the data sheetGo

Changes from Revision D (October 2019) to Revision E (September 2020)

  • Updated the numbering format for tables, figures and cross-references throughout the documentGo

Changes from Revision C (October 2018) to Revision D (October 2019)

  • Changed package dimensions from 0.74 mm x 0.74 mm to 0.78 mm x 0.78 mmGo

Changes from Revision B (December 2017) to Revision C (October 2018)

  • Changed Package Drawing Dimensions Go

Changes from Revision A (September 2017) to Revision B (December 2017)

  • Changed Pinout drawing labeled Laser MarkingGo

Changes from Revision * (July 2017) to Revision A (September 2017)

  • Changed device document from Advanced Info to Production Data Go