SLVSGS7D July   2023  – June 2024 TPSM8287A06 , TPSM8287A10 , TPSM8287A12 , TPSM8287A15

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Options
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Interface Timing Characteristics
    7. 6.7 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Fixed-Frequency DCS-Control Topology
      2. 7.3.2  Forced-PWM and Power-Save Modes
      3. 7.3.3  Precise Enable
      4. 7.3.4  Start-Up
      5. 7.3.5  Switching Frequency Selection
      6. 7.3.6  Output Voltage Setting
        1. 7.3.6.1 Output Voltage Setpoint
        2. 7.3.6.2 Output Voltage Range
        3. 7.3.6.3 Non-Default Output Voltage Setpoint
        4. 7.3.6.4 Dynamic Voltage Scaling (DVS)
      7. 7.3.7  Compensation (COMP)
      8. 7.3.8  Mode Selection / Clock Synchronization (MODE/SYNC)
      9. 7.3.9  Spread Spectrum Clocking (SSC)
      10. 7.3.10 Output Discharge
      11. 7.3.11 Undervoltage Lockout (UVLO)
      12. 7.3.12 Overvoltage Lockout (OVLO)
      13. 7.3.13 Overcurrent Protection
        1. 7.3.13.1 Cycle-by-Cycle Current Limiting
        2. 7.3.13.2 Hiccup Mode
        3. 7.3.13.3 Current-Limit Mode
      14. 7.3.14 Power Good (PG)
        1. 7.3.14.1 Power-Good Standalone, Primary Device Behavior
        2. 7.3.14.2 Power-Good Secondary Device Behavior
      15. 7.3.15 Remote Sense
      16. 7.3.16 Thermal Warning and Shutdown
      17. 7.3.17 Stacked Operation
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power-On Reset (POR)
      2. 7.4.2 Undervoltage Lockout
      3. 7.4.3 Standby
      4. 7.4.4 On
    5. 7.5 Programming
      1. 7.5.1 Serial Interface Description
      2. 7.5.2 Standard-, Fast-, Fast-Mode Plus Protocol
      3. 7.5.3 I2C Update Sequence
      4. 7.5.4 I2C Register Reset
  9. Device Registers
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Selecting the Input Capacitors
        2. 9.2.2.2 Selecting the Target Loop Bandwidth
        3. 9.2.2.3 Selecting the Compensation Resistor
        4. 9.2.2.4 Selecting the Output Capacitors
        5. 9.2.2.5 Selecting the Compensation Capacitor, CComp1
        6. 9.2.2.6 Selecting the Compensation Capacitor, CComp2
      3. 9.2.3 Application Curves
    3. 9.3 Typical Application Using Four TPSM8287Axx in Parallel Operation
      1. 9.3.1 Design Requirements
      2. 9.3.2 Detailed Design Procedure
        1. 9.3.2.1 Selecting the Input Capacitors
        2. 9.3.2.2 Selecting the Target Loop Bandwidth
        3. 9.3.2.3 Selecting the Compensation Resistor
        4. 9.3.2.4 Selecting the Output Capacitors
        5. 9.3.2.5 Selecting the Compensation Capacitor, CComp1
        6. 9.3.2.6 Selecting the Compensation Capacitor, CComp2
      3. 9.3.3 Application Curves
    4. 9.4 Power Supply Recommendations
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
      2. 9.5.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Output Discharge

The device has an output discharge function which makes sure a defined ramp down of the output voltage when the device is disabled. The discharge stays on after the output is discharged. The output discharge function is enabled when DISCHEN = 1 in the CONTROL1 register.

If output discharge is enabled, the device discharges the output under the following conditions:

  • A low level is applied to the EN pin
  • SWEN = 0 in the CONTROL1 register
  • A thermal shutdown event occurs
  • An UVLO event occurs
  • An OVLO event occurs

When the output voltage is above 900 mV (typical), the discharge is about 115 mA. Below 900 mV, the discharge is about 3.5 Ohm. Figure 7-17 shows an example of the typical discharge behavior.

TPSM8287A06 TPSM8287A10 TPSM8287A12 TPSM8287A15 Output Discharge
VIN = 5.0 V

IOUT = 0 mA

VOUT = 3.3 V discharge to 0 V

Figure 7-17 Output Discharge

The output discharge function is not available until the device has been enabled at least once after applying VIN. The output discharge functions until VIN drops to around 1.8 V.

In a stacked configuration, the discharge is always active in the secondary devices. Please refer to Table 7-6.