SLVSHZ9 August   2024 ESD851

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings—JEDEC Specification
    3. 5.3 ESD Ratings—IEC Specification
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Thermal Information
    6. 5.6 Electrical Characteristics
    7. 5.7 Typical Characteristics
  7. 6Application and Implementation
    1. 6.1 Application Information
  8. 7Device and Documentation Support
    1. 7.1 Documentation Support
      1. 7.1.1 Related Documentation
    2. 7.2 Receiving Notification of Documentation Updates
    3. 7.3 Support Resources
    4. 7.4 Trademarks
    5. 7.5 Electrostatic Discharge Caution
    6. 7.6 Glossary
  9. 8Revision History
  10. 9Mechanical, Packaging, and Orderable Information
    1. 9.1 Tape and Reel Information
    2. 9.2 Mechanical Data

5.5 Thermal Information

THERMAL METRIC (1) ESD851 UNIT
DYF (SOD-323)
2 PINS
RθJA Junction-to-ambient thermal resistance 686.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 267.0 °C/W
RθJB Junction-to-board thermal resistance 560.5 °C/W
ΨJT Junction-to-top characterization parameter 91.4 °C/W
ΨJB Junction-to-board characterization parameter 546.2 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.