This User’s Guide can be used as a guide for integrating the TPS65941515-Q1 power management integrated circuit (PMIC) into a system powering the Automotive Jacinto™ 7 DRA821 processor.
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This user’s guide describes a power distribution network (PDN), PDN-2A, using a single TPS6594-Q1 PMIC and a few discrete components to power the DRA821 processor and peripherals.
The following topics are described to clarify platform system operation:
There are different versions of the TPS6594-Q1 device available with unique NVM settings to support different processor solutions. The unique NVM settings for each PMIC device are optimized per PDN design to support different processors, processing loads, SDRAM types, system functional safety levels, and end product features (such as low power modes, processor voltages, and memory subsystems). The NVM settings can be identified by both the TI_NVM_ID and NVM_REV registers.
PDN USE CASE | Orderable Part Number | TI_NVM_ID | TI_NVM_REV |
---|---|---|---|
|
TPS65941515 | 0x15 | 0x03 |
This section details how the TPS65941515-Q1 power resources and GPIO signals are connected to the processor and other peripheral components.
Figure 3-1 shows the power mapping between the TPS65941515-Q1 PMIC and peripheral regulators to power the processor and associated accessories. In this configuration, the PMIC and additional resources use a 3.3 V input voltage. For Functional Safety applications, there is a protection FET before VCCA that connects to the OVPGDRV pin of the PMIC, allowing voltage monitoring of the input supply to the system.
This PDN uses five discrete power components with four being required and one is optional depending upon end product features. The two TPS22965-Q1 Load Switches connect VCCA_3V3 power rail to supply 3.3 V to processor I/O domains. The third discrete device is a TPS274501-Q1 LDO is used to supply power in low-power retention mode. The fourth discrete device is a TLV73318-Q1 LDO which supplies the LPDDR4 SDRAM component with required 1.8V supply. The last discrete power component is an optional TLV73318-Q1 LDO that can be used if an end product uses a high security processor type and desires the capability to program EFUSE values on-board. If this feature is not desired, then this LDO can be omitted and processor pins terminated per data manual recommendations.
Table 3-1 identifies which power resources are required to support different system features. In the Active SoC column, there is an additional option for including or excluding the VPP_x(EFUSE) rail.
Power Mapping | System Features(1) | |||||||
---|---|---|---|---|---|---|---|---|
Device | Power Resource | Power Rails | Processor and Memory Domains | Active SoC |
GPIO Retention |
DDR Retention | SD Card | USB Interface |
TPS65941515-Q1 | BUCK12 | VDD_CPU_AVS | VDD_CPU | R | ||||
BUCK34 |
VDD_CORE_0V8 |
VDD_MCU, VDDA_SERDES |
R | |||||
BUCK5 | VDD_DDR_1V1 |
VDDS_DDR |
R |
R |
||||
Mem: LPDDR4_VDD2 and VDDQ |
||||||||
LDO1 | VDD_IO_1V8 | VDDS_MMC0, VDDSHVx_MCU(1.8V) | R | |||||
Mem: VCC |
||||||||
LDO2 | VDD_RAM_0V85 |
VDDAR_MCU, VDDAR_CPU/CORE |
R | |||||
LDO3 | VDA_DPLL_0V8 | VDDA_0P8_PLLs/DLLs | R | |||||
LDO4 | VDA_LN_1V8 | VDDA_x(1.8V) | R | |||||
TPS22965-Q1 | Load Switch-A | VDD_IO_3V3 | VDDSHVx_MCU (3.3 V), VDDSHV0, VDDSHV5 |
R |
R |
R |
||
Mem: EMMC VCC |
||||||||
TPS22965-Q1 | Load Switch-B | VDD_GPIORET_3V3 | VDDSHV0-4,VDDSHV6 (3.3 V) | R |
R |
|||
TPS74501P-Q1 |
LDO-A |
VDD_WK_0V8 |
VDDSHV2 |
R |
R |
|||
TLV73318P-Q1 | LDO-B |
VDD1_LPDDR4_1V8 |
Mem: LPDDR4_VDD1 |
R |
||||
TLV73318P-Q1 | LDO-C |
VPP_EFUSE_1V8 |
VPP_x(EFUSE) |
O |
Figure 3-2 shows the digital control signal mapping between processor, PMIC, and discrete power devices. Connections from the TPS65941515 PMIC to the processor provide error monitoring, processor reset, processor wake up, and system low-power modes. Specific GPIO pins have been assigned to key signals in order to ensure proper operation during low power modes when only a few GPIO pins remain operational.
The digital connections shown in Figure 3-2 allow system features including GPIO and DDR Retention modes, functional safety up to ASIL-D, and compliant dual voltage SD card operation.
PDN Signal | Pullup Power Rail |
---|---|
H_MCU_INTn_3V3 | VDD_IO_3V3 |
H_SOC_PORz_1V8 | VDA_LN_1V8 |
EN_DDR_RET_1V1 | VDD_DDR_1V1_REG |
H_WKUP_I2C0 | VDD_IO_3V3 |
H_MCU_I2C0_SCL/SDA | VDD_IO_3V3 |
Please use Table 3-3 as a guide to understand GPIO assignments required for each PDN system feature. If the feature listed is not required, the digital connection can be removed; however, the GPIO pin is still configured per NVM defined default function shown. After the processor has booted up, the processor can reconfigure unused GPIOs to support new functions. Reconfiguring unused GPIOs is possible as long as that function is only needed after boot and default function does not cause any conflicts with normal operations (for example, two outputs driving same net). For details on how functional safety related connections help achieve functional safety system-level goals, see Section 4.
Device | GPIO Mapping | System Features(1) | |||||
---|---|---|---|---|---|---|---|
PMIC Pin | NVM Function | PDN Signals | Active SoC | Functional Safety | DDR Retention | GPIO Retention | |
TPS65941515-Q1 | nPWRON/ ENABLE | Enable | SOC_PWR_ON | R | |||
INT | INT | H_MCU_INTn | R | ||||
nRSTOUT | nRSTOUT | H_SOC_PORz_1V8 | R | ||||
SCL_I2C1 | SCL_I2C1 | H_WKUP_I2C0 | R | ||||
SDA_I2C1 | SDA_I2C1 | H_WKUP_I2C0 | R | ||||
GPIO_1 | SCL_I2C2 | H_MCU_I2C0_SCL | R | ||||
GPIO_2 | SDA_I2C2 | H_MCU_I2C0_SDA | R | ||||
GPIO_3 | nERR_SoC | H_SOC_SAFETY_ERRn | O | ||||
GPIO_4 | LP_WKUP1(2) | PMIC_WAKE1 | R | R | |||
GPIO_5 | GPO | EN_GPIORET_VWK | R | R | |||
GPIO_6 | GPO | EN_DDR_RET_1V1 | R | ||||
GPIO_7 | nERR_MCU | H_MCU_SAFETY_ERRn | R | ||||
GPIO_8 | DISABLE_WDOG | PMICA_GPIO8 | (3) | (3) | |||
GPIO_9 | GPO | EN_GPIORET_VIO | R | R | |||
GPIO_10 | CLK32OUT | H_WKUP_LFOSCO_XI | O | ||||
GPIO_11 | GPO | EN_SOC_VIO | R | R |