SLVUCD9B January   2022  – March 2023 TPS61376

 

  1.   Abstract
  2.   Trademarks
  3. 1Introduction
    1. 1.1 Performance Specification
    2. 1.2 Modification
    3. 1.3 Input Capacitor C8
  4. 2Test Setup
    1. 2.1 Input/Output Connector Descriptions
  5. 3Schematic and Bill of Materials
    1. 3.1 Schematic
    2. 3.2 Bill of Materials
  6. 4Board Layout
  7. 5Revision History

4 Board Layout

The TPS61376 EVM board is a 4-layer, 1-oz copper thick PCB. All the components are placed on the top layer. #FIG_BTL_1XJ_FSB and #FIG_C3M_CXJ_FSB show the top view and bottom view, respectively. #FIG_L1J_2XJ_FSB and #FIG_LCM_FXJ_FSB show the inner layer 1 and inner layer 2, respectively.

GUID-20220824-SS0I-R0S3-3LCR-C6RFJSKR0V6L-low.gif Figure 4-1 Top-Side Layout
GUID-20220824-SS0I-1SHW-Q7Z8-TRTDQ3GTKT7Q-low.gif Figure 4-2 Bottom-Side Layout
GUID-20220824-SS0I-JLJ8-8W9K-XK87GMJV3457-low.gif Figure 4-3 Inner Layer 1 Layout
GUID-20220824-SS0I-K3PP-K0WB-VDZBK1VRS3N1-low.gif Figure 4-4 Inner Layer 2 Layout