SLVUCG3A September   2022  – March 2023 TPSM33625

 

  1.   Abstract
  2.   Trademarks
  3. 1Introduction
  4. 2Setup Procedure
  5. 3Test Setup
  6. 4Schematic
  7. 5TPSM33625EVM and TPSM33625FEVM Evaluation
  8. 6Layout
  9. 7Bill of Materials
  10. 8Related Documentation
  11. 9Revision History

Layout

The top silkscreen (that is, J4) differs between the TPSM33625EVM and TPSM3365FEVM, which is the only difference between the layer plots (no routing).

GUID-20220510-SS0I-4LXM-KJSW-G37Q8MMG65F2-low.pngFigure 6-1 PCB Top 2-D (TPSM33625EVM)
GUID-20220721-SS0I-BLTR-33PZ-CKMKFCXXP7VF-low.pngFigure 6-2 PCB Top 2-D (TPSM33625FEVM)
GUID-20220510-SS0I-WFZL-V7TB-S9X39ZSQTTJP-low.pngFigure 6-3 PCB Bottom 2-D
GUID-20220510-SS0I-8G2W-JKWG-1LQHZ35BLTVC-low.pngFigure 6-4 Top Layer

Reserved for solid ground plane for low-noise and optimized thermal design.

GUID-20220510-SS0I-QMSK-2H2F-JTT6NLGZZCWM-low.pngFigure 6-5 Mid Layer 1

Primary routing layer

GUID-20220510-SS0I-QV28-BRBW-95SGLFNWBZSC-low.pngFigure 6-6 Mid Layer 2

Reserved for PI filter and non-critical passive component placement (minus input capacitor). An input capacitor is placed on bottom side of PCB as the input capacitor provides a slightly lower input loop inductance. A single layer implementation is satisfactory as well.

GUID-20220510-SS0I-GHF6-1BTK-NWNW6NH2Q8VV-low.pngFigure 6-7 Bottom Layer