SLVUCJ6A November   2022  – August 2024 LP5890

 

  1.   1
  2.   Description
  3.   Features
  4.   Applications
  5.   5
  6. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  7. 2Hardware
    1. 2.1 Function Descriptions
    2. 2.2 Test Setup
      1. 2.2.1 System/Tool Requirements
      2. 2.2.2 Hardware Setup for Single Device
      3. 2.2.3 Hardware Setup for Dual Cascaded Devices
  8. 3Software
    1. 3.1 Software Setup
  9. 4Hardware Design Files
    1. 4.1 Schematic
    2. 4.2 PCB Layout
    3. 4.3 Bill of Materials
  10. 5Additional Information
    1. 5.1 Additional Resources
    2. 5.2 Trademarks
  11. 6Revision History

PCB Layout

The PCB layout of the EVM is shown below.

LP5890EVM LP5890EVM Top
                        LayerFigure 4-5 LP5890EVM Top Layer
LP5890EVM LP5890EVM Signal Layer
                        2Figure 4-7 LP5890EVM Signal Layer 2
LP5890EVM LP5890EVM Signal Layer
                        1Figure 4-6 LP5890EVM Signal Layer 1
LP5890EVM LP5890EVM Bottom
                        LayerFigure 4-8 LP5890EVM Bottom Layer