SLVUCY4 June   2024 LM5190-Q1

 

  1.   1
  2.   Description
  3.   Features
  4.   Applications
  5.   5
  6. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  7. 2Hardware
    1. 2.1 Test Setup and Procedure
      1. 2.1.1 EVM Connections
      2. 2.1.2 Test Equipment
      3. 2.1.3 Recommended Test Setup
        1. 2.1.3.1 Input Connections
        2. 2.1.3.2 Output Connections
      4. 2.1.4 Test Procedure
        1. 2.1.4.1 Basic Test Procedure
  8. 3Implementation Results
    1. 3.1 Test Data and Performance Curves
      1. 3.1.1 Efficiency
      2. 3.1.2 Operating Waveforms
        1. 3.1.2.1 Start-Up and Shutdown With EN
        2. 3.1.2.2 Switching
        3. 3.1.2.3 Load Transient (CV), ISET Modulation (CC)
      3. 3.1.3 Thermal Performance
      4. 3.1.4 Bode Plot
      5. 3.1.5 EMI Performance
  9. 4Hardware Design Files
    1. 4.1 Schematic
    2. 4.2 PCB Layout
    3. 4.3 Bill of Materials
  10. 5Additional Information
    1. 5.1 Trademarks
  11. 6Device and Documentation Support
    1. 6.1 Device Support
      1. 6.1.1 Development Support
    2. 6.2 Documentation Support
      1. 6.2.1 Related Documentation
        1. 6.2.1.1 PCB Layout Resources
        2. 6.2.1.2 Thermal Design Resources

4.2 PCB Layout

LM5190 EVM uses a 6-layer PCB with 2-oz copper thickness.

LM5190QEVM-400 Top Components (Top View) Figure 4-2 Top Components (Top View)
LM5190QEVM-400 Bottom Components (Bottom View) Figure 4-3 Bottom Components (Bottom View)
LM5190QEVM-400 Top Layer Copper (Top View) Figure 4-4 Top Layer Copper (Top View)
LM5190QEVM-400 Layer 2 Copper (Top View) Figure 4-5 Layer 2 Copper (Top View)
LM5190QEVM-400 Layer 3 Copper (Top View) Figure 4-6 Layer 3 Copper (Top View)
LM5190QEVM-400 Layer 4 Copper (Top View) Figure 4-7 Layer 4 Copper (Top View)
LM5190QEVM-400 Layer 5 Copper (Top View) Figure 4-8 Layer 5 Copper (Top View)
LM5190QEVM-400 Bottom Copper (Top View) Figure 4-9 Bottom Copper (Top View)