SLVUD04 August   2024 TPSM83102

 

  1.   1
  2.   Description
  3.   Features
  4.   4
  5. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  6. 2Hardware
    1. 2.1 Background
    2. 2.2 Setup
    3. 2.3 Input and Output Connectors, Test Points, and Headers Description
      1. 2.3.1 J1, Pin 1 and 2 – VIN
      2. 2.3.2 J1, Pin 3 and 4 – S+/S-
      3. 2.3.3 J1, Pin 5 and 6 – GND
      4. 2.3.4 J2, Pin 1 and 2 – VOUT
      5. 2.3.5 J2, Pin 3 and 4 – S+/S-
      6. 2.3.6 J2, Pin 5 and 6 – GND
      7. 2.3.7 Test Points
        1. 2.3.7.1 TP1, TP2
      8. 2.3.8 Header Information
        1. 2.3.8.1 J4– I2C
      9. 2.3.9 Jumper Information
        1. 2.3.9.1 JP1 – ENABLE
    4. 2.4 Setup
    5. 2.5 Modifications
      1. 2.5.1 IC U1 Operation
  7. 3Software
    1. 3.1 Software Setup
    2. 3.2 Interface Hardware Setup
    3. 3.3 User Interface Operation
      1. 3.3.1 Home Screen
      2. 3.3.2 Settings Screen
      3. 3.3.3 Register Map Screen
    4. 3.4 Register Map
      1. 3.4.1 Register CONTROL1 (Target Address: 0x2A; Register Address: 0x02; Default: 0x08)
      2. 3.4.2 Register VOUT (Target Address: 0x2A; Register Address: 0x03; Default: 0x5C)
      3. 3.4.3 Register CONTROL2 (Target Address: 0x2A; Register Address: 0x05; Default:0x45)
  8. 4Hardware Design Files
    1. 4.1 Schematic
    2. 4.2 Board Layout
    3. 4.3 Bill of Materials
  9. 5Additional Information
    1. 5.1 Trademarks

1.2 Kit Contents

Table 1-1 Kit List
DesignatorQuantityDescriptionMaterial TypePackaging
PCB11'TPSM83102EVM; circuit board;EEEBag, ESD
BOX11Box, CardboardCardboardBox
FM12Foam, AntistaticPlasticFoam
LBL11Label, Small & Large standard labelsPaper/card stockPaper
LIT11Literature, EVM Disclaimer Read MePaper/card stockPaper
LIT21Literature, EVM Disclaimer Read MePaper/card stockPaper