SNAK022 May   2024 LMX1860-SEP

 

  1.   1
  2.   LMX1860-SEP Single-Event Effects Test Report
  3.   Trademarks
  4. 1Product Description
  5. 2Test Setup
    1. 2.1 SEL Test
    2. 2.2 SEFI Test
    3. 2.3 Test Facility
  6. 3Results
    1. 3.1 SEL Results
    2. 3.2 SEFI Results
  7. 4Summary
  8. 5References

2 Test Setup

The LMX1860-SEP was monitored for Single-Event Latchup (SEL), Single-Event Functional and Interrupt (SEFI). Single-Event Upsets (SEU) were monitored but not characterized.

The device under test (DUT) was soldered to a custom evaluation board. The DUT was delidded by a chemical process to expose the die surface to the ion beam prior to being soldered to the board.

LMX1860-SEP SEE DUT BoardFigure 2-1 LMX1860-SEP SEE DUT Board

A single power supply was used supply the DUT. The power supply current was monitored during each ion run. The voltage was set to 2.6V as measured at the DUT board.

The registers were written using Texas Instruments USB2ANY PC interface and TICS PRO software (4).

An 800MHz single was supplied to the input using a Rohde & Schwarz® SMB100A signal generator. The CLKOUT3 and SYSREFOUT1 were connected to a Teradyne® DPO7354 oscilloscope.

The DUT was configured in buffer mode with all outputs enabled, so that all CLKOUTx outputs were at 800MHz. The SYSREFOUTx outputs were configured to 6.25MHz.