11.1 Layout Guidelines
The LMP92066 is a device for which the input signal is temperature. The primary path of heat conduction is through the exposed PowerPAD on the underside of the package. The layout should provide direct, high thermal conductivity path between the LMP92066 and the devices controlled by its output:
- Use heavy copper layer as the thermal conduction path. This layer must be also a GND node.
- If the heavy copper layer is not a top layer, use a dense array of vias to connect to both the LMP92066 and the heat sources to maintain high thermal conductivity.
- Place the LMP92066 in the geometric center between the multiple heat sources in order to minimize the “thermal offsets” due to the temperature gradients.