SNLA466A August   2024  – October 2024 DP83822I , DP83826E , DP83826I , DP83867E , DP83867IR , DP83869HM

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Abbreviation
  5. 2Introduction
  6. 3EMC Emission
    1. 3.1 Radiated Emission
      1. 3.1.1 Test Setup for Radiated Emission Test
      2. 3.1.2 Main Radiated Emission Sources
    2. 3.2 Conducted Emission
      1. 3.2.1 Test Setup for Conducted Emission Test
      2. 3.2.2 Main Conducted Emission Sources
    3. 3.3 Debug Procedure on EMC Emission
      1. 3.3.1 General Debug Procedure
      2. 3.3.2 RE Specific Debug
      3. 3.3.3 CE Specific Debug
  7. 4EMC Immunity Test
    1. 4.1 EMI Passing Criteria
    2. 4.2 Common EMI Knowledge
    3. 4.3 IEC61000 4-2 ESD
      1. 4.3.1 ESD Test Setup
      2. 4.3.2 Possible Root Cause of Failure
      3. 4.3.3 Debug Procedure
        1. 4.3.3.1 Follow the Test Setup
        2. 4.3.3.2 Remove External Factors on Cable or Link Partner
        3. 4.3.3.3 Areas to Explore to Improve ESD Performance
          1. 4.3.3.3.1 Air or Capacitive Coupling Discharge ESD Recommendations
          2. 4.3.3.3.2 Direct Contact Discharge ESD Recommendation
        4. 4.3.3.4 Schematic and Layout Recommendations
    4. 4.4 IEC 61000 4-3 RI
      1. 4.4.1 RI Test Setup
      2. 4.4.2 Possible Root Cause of Failure
      3. 4.4.3 Debug Procedure
        1. 4.4.3.1 Follow RI Test Setup
        2. 4.4.3.2 Remove External Factor on Cable or Link Partner
        3. 4.4.3.3 Found out Main Emission Area
        4. 4.4.3.4 Schematic and Layout Recommendation
    5. 4.5 IEC 61000 4-4 EFT
      1. 4.5.1 EFT Test Setup
      2. 4.5.2 Possible Root Cause of Failure
      3. 4.5.3 Debug Procedure
        1. 4.5.3.1 Follow EFT Test Setup
        2. 4.5.3.2 Remove External Factor on Cable or Link Parnter
        3. 4.5.3.3 Areas to Explore to Improve EFT Performance
        4. 4.5.3.4 Schematic and Layout Recommendation
    6. 4.6 IEC 61000 4-5 Surge
      1. 4.6.1 Surge Test Setup
      2. 4.6.2 Possible Root Cause of Failure
      3. 4.6.3 Debug Procedure
        1. 4.6.3.1 Follow Surge Test Setup
        2. 4.6.3.2 Remove External Factor on Cable or Link Partner
        3. 4.6.3.3 Area to Explore to Improve Surge Performance
        4. 4.6.3.4 Schematic and Layout Recommendation
    7. 4.7 IEC 61000 4-6 CI
      1. 4.7.1 CI Test Setup
      2. 4.7.2 Possible Root Cause of Failure
      3. 4.7.3 Debug Procedure
        1. 4.7.3.1 Follow CI Test Setup
        2. 4.7.3.2 Remove External Factors on Cable or Link Partner
        3. 4.7.3.3 Areas to Explore to Improve CI Performance
        4. 4.7.3.4 Schematic and Layout Recommendation
  8. 5Schematic and Layout Recommendation for All EMC, EMI Tests
    1. 5.1 Schematic Recommendation
    2. 5.2 Layout Recommendation
  9. 6Summary
  10. 7References
  11. 8Revision History

3.2.2 Main Conducted Emission Sources

  1. Signal and cable path
    • Non-MDI signal traces and clock sources near the connector or MDI lines
    • Interconnection distance between the MDI lines is too close
      • Interconnection distance is the distance between differential pair
    • External noise sources near cable
  2. Cable type mismatch
    • Mismatch between DUT and LP cable type
    • Mismatch between DUT/LP and CDN cable type