SNLA466A August   2024  – October 2024 DP83822I , DP83826E , DP83826I , DP83867E , DP83867IR , DP83869HM

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Abbreviation
  5. 2Introduction
  6. 3EMC Emission
    1. 3.1 Radiated Emission
      1. 3.1.1 Test Setup for Radiated Emission Test
      2. 3.1.2 Main Radiated Emission Sources
    2. 3.2 Conducted Emission
      1. 3.2.1 Test Setup for Conducted Emission Test
      2. 3.2.2 Main Conducted Emission Sources
    3. 3.3 Debug Procedure on EMC Emission
      1. 3.3.1 General Debug Procedure
      2. 3.3.2 RE Specific Debug
      3. 3.3.3 CE Specific Debug
  7. 4EMC Immunity Test
    1. 4.1 EMI Passing Criteria
    2. 4.2 Common EMI Knowledge
    3. 4.3 IEC61000 4-2 ESD
      1. 4.3.1 ESD Test Setup
      2. 4.3.2 Possible Root Cause of Failure
      3. 4.3.3 Debug Procedure
        1. 4.3.3.1 Follow the Test Setup
        2. 4.3.3.2 Remove External Factors on Cable or Link Partner
        3. 4.3.3.3 Areas to Explore to Improve ESD Performance
          1. 4.3.3.3.1 Air or Capacitive Coupling Discharge ESD Recommendations
          2. 4.3.3.3.2 Direct Contact Discharge ESD Recommendation
        4. 4.3.3.4 Schematic and Layout Recommendations
    4. 4.4 IEC 61000 4-3 RI
      1. 4.4.1 RI Test Setup
      2. 4.4.2 Possible Root Cause of Failure
      3. 4.4.3 Debug Procedure
        1. 4.4.3.1 Follow RI Test Setup
        2. 4.4.3.2 Remove External Factor on Cable or Link Partner
        3. 4.4.3.3 Found out Main Emission Area
        4. 4.4.3.4 Schematic and Layout Recommendation
    5. 4.5 IEC 61000 4-4 EFT
      1. 4.5.1 EFT Test Setup
      2. 4.5.2 Possible Root Cause of Failure
      3. 4.5.3 Debug Procedure
        1. 4.5.3.1 Follow EFT Test Setup
        2. 4.5.3.2 Remove External Factor on Cable or Link Parnter
        3. 4.5.3.3 Areas to Explore to Improve EFT Performance
        4. 4.5.3.4 Schematic and Layout Recommendation
    6. 4.6 IEC 61000 4-5 Surge
      1. 4.6.1 Surge Test Setup
      2. 4.6.2 Possible Root Cause of Failure
      3. 4.6.3 Debug Procedure
        1. 4.6.3.1 Follow Surge Test Setup
        2. 4.6.3.2 Remove External Factor on Cable or Link Partner
        3. 4.6.3.3 Area to Explore to Improve Surge Performance
        4. 4.6.3.4 Schematic and Layout Recommendation
    7. 4.7 IEC 61000 4-6 CI
      1. 4.7.1 CI Test Setup
      2. 4.7.2 Possible Root Cause of Failure
      3. 4.7.3 Debug Procedure
        1. 4.7.3.1 Follow CI Test Setup
        2. 4.7.3.2 Remove External Factors on Cable or Link Partner
        3. 4.7.3.3 Areas to Explore to Improve CI Performance
        4. 4.7.3.4 Schematic and Layout Recommendation
  8. 5Schematic and Layout Recommendation for All EMC, EMI Tests
    1. 5.1 Schematic Recommendation
    2. 5.2 Layout Recommendation
  9. 6Summary
  10. 7References
  11. 8Revision History

RE Specific Debug

  1. General configuration to optimize PHY’s Radiated Emission
    • Turn off the CLK_OUT pins or any unused clock sources for both DUT and Link Partner during the test. TI's PHY CLK_OUT pin can always generate 25MHz or 50MHz clock signal on the pins, resulting in unnecessary emissions to the surrounding when this feature is not used.
    • Turn off TX/RX activity on the DUT/LP's LED pins. Verify none of the LED pins are configured in RX or TX activity mode. Constant LED blinking during TX/RX activity can result in extra radiated emissions for lower frequency ranges
  2. Remove external factors on cable or link partner on RE test
    • Use shorted cable lengths to minimize the effect of the cable
    • Change the link partner board to the same as DUT board to factor out the issue on Link Partner board
    • Shield both Link Partner and Ethernet cable with earth ground to eliminate the radiation effect of the non DUT board
    • Enable loopback and remove the cable to isolate any radiated emission effects from the cable

    If the above suggestions do not resolve RE test failure, the main emission source is likely the DUT. Reference the points below to investigate and address the root cause with schematic/layout optimizations.

  3. Read the failure frequency range on RE test
    • If the lower frequency ranges are failing, check the emission due to power rail circuitry, such as the switching frequency
    • If the failing frequency borders 25MHz or the harmonics, the cause is likely the crystal or oscillator path
    • If the failing frequency matches the MAC to PHY clock frequency, the cause is likely the MAC interface path
    • If the failing frequency is close to the MDI frequency, the root cause is likely with the MDI interface path

    The next section details how to isolate each of the above root causes from the DUT, depending on the failing frequency range.

  4. Isolate other ICs on the DUT board from the PHY to minimize potential effect
    • Configure Ethernet PHY in reset stage or low power mode.
      • Verify if the main emission are coming from external components on the board
    • Disable or power off all other ICs. Only enable PRBS test on DUT and reverse loopback on the Link Partner side
      • This helps isolate noise generated by other components on the DUT board. Packets are still generated between the two PHYs when PRBS is enabled
    • Enable MAC isolation to reduce the effect on the MAC side
      • MAC isolation is enabled with register 0x0[10], defined by the IEEE standard
      • This helps isolate emission sources between the MAC and PHY interface
  5. Use copper tape to isolate the main emission area around the PHY.
    • Cover possible emission sources with copper tape to isolate the root cause on DUT board:
      • Copper tape needs to be strongly connected to earth ground to absorb most of the emission noise. If the copper tape is not connected to earth ground properly, the copper tape can act as an antenna source , further amplifying the signals from the covered area
      • Verify there is an insulator between the copper tape and board components to prevent shorting between the parts
    • Use copper tape to cover the area around the PHY’s IC only to see if PHY’s IC are the main radiated source
    • Use copper tape to cover the clock signals (Crystal, Oscillator, RMII clock, MDC, and so on) to see if the clock sources are the main emission source
      • Impedance matching on signal ended clock signal can help with the emission on the clock signal lines.
    • Use copper tape to cover the area around MDI lines to see if MDI lines are the main emission source
      • Reduce the length of MDI line and prevent the sharp turn on the MDI lines can reduce the emission on MDI lines
    • Use copper tape to cover the area around the MAC to PHY interface trace to see if the MAC interface is the main emission source
      • Slew rate control can help to reduce the emission on the MAC interface
      • Bury MAC traces can also further reduce the emission on MAC interface
  6. Schematic and layout recommendations
    • After performing the debug procedures above to isolate the main emission source, please follow the schematic and layout recommendations to further optimize EMC/EMI performance of the design.