SNLS461A May   2013  – June 2015 DS110DF111

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Device Data Path Operation
        1. 7.3.1.1 Input Channel Equalization
        2. 7.3.1.2 Clock And Data Recovery
        3. 7.3.1.3 PRBS Pattern Generator
        4. 7.3.1.4 Datapath Multiplexer and Output Driver
        5. 7.3.1.5 Reference Clock
        6. 7.3.1.6 Control Pins
          1. 7.3.1.6.1 Pin Mode Limitation
        7. 7.3.1.7 Eye Opening Monitor
    4. 7.4 Device Functional Modes
      1. 7.4.1 Control Pin Mode
      2. 7.4.2 SMBus Master Mode and SMBus Slave Mode
    5. 7.5 Programming
      1. 7.5.1 SMBus Interface
        1. 7.5.1.1  Address Lines
        2. 7.5.1.2  Device Configuration in SMBus Slave Mode
        3. 7.5.1.3  Bit Fields in the Register Set
        4. 7.5.1.4  Writing to and Reading From the Control/Shared Registers
        5. 7.5.1.5  SMBus Strap Observation
        6. 7.5.1.6  Interrupt Channel Flag Bits
        7. 7.5.1.7  Control/Shared Register Reset
        8. 7.5.1.8  Device Revision and Device ID
        9. 7.5.1.9  Channel Select Register
        10. 7.5.1.10 Resetting Individual Channels of the Retimer
        11. 7.5.1.11 Rate and Subrate Setting
        12. 7.5.1.12 Overriding the CTLE Boost Setting
        13. 7.5.1.13 Overriding the Output Multiplexer
        14. 7.5.1.14 Overriding the VCO Divider Selection
        15. 7.5.1.15 Using the Internal Eye Opening Monitor
        16. 7.5.1.16 Overriding the DFE Tap Weights and Polarities
        17. 7.5.1.17 Enabling Slow Rise/Fall Time on the Output Driver
        18. 7.5.1.18 Using the PRBS Generator
        19. 7.5.1.19 Inverting the Output Polarity
        20. 7.5.1.20 Overriding the Figure of Merit Adaption
        21. 7.5.1.21 Setting the Rate and Subrate for Lock Acquisition
        22. 7.5.1.22 Setting the Adaption/Lock Mode
        23. 7.5.1.23 Initiating Adaption
        24. 7.5.1.24 Overriding the CTLE Settings used for CTLE Adaption
        25. 7.5.1.25 Setting the Output Differential Voltage
        26. 7.5.1.26 Setting the Output De-Emphasis Setting
        27. 7.5.1.27 CTLE Setting for Divide by 4 and Divide by 8 VCO Ranges
    6. 7.6 Register Maps
      1. 7.6.1 Reading to and Writing From the Channel Registers
  8. Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
        1. 8.2.3.1 SFF-8431 Testing
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

11 Device and Documentation Support

11.1 Documentation Support

11.1.1 Related Documentation

    Absolute Maximum Ratings for Soldering, SNOA549

11.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.3 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.4 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.5 Glossary

SLYZ022TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.