SNLS461A May 2013 – June 2015 DS110DF111
PRODUCTION DATA.
PIN | TYPE | DESCRIPTION | |
---|---|---|---|
NAME | NUMBER | ||
HIGH SPEED DIFFERENTIAL I/OS | |||
OUTA± | 7, 8 | O, CML | Inverting and noninverting CML-compatible differential outputs. Outputs require AC coupling |
OUTB± | 20, 19 | O, CML | Inverting and noninverting CML-compatible differential outputs. Outputs require AC coupling |
INA± | 24, 23 | I, CML | Inverting and noninverting CML-compatible differential inputs. An on-chip 100 Ohm terminating resistor connects INA+ to INA- Inputs require AC coupling. TI recommends 100 nF capacitors. Note that for SFP+ applications, AC coupling is included as part of the SFP+ module. |
INB± | 11, 12 | I, CML | Inverting and noninverting CML-compatible differential inputs. An on-chip 100 Ohm terminating resistor connects INB+ to INB- Inputs require AC coupling. TI recommends 100 nF capacitors. Note that for SFP+ applications, AC coupling is included as part of the SFP+ module. |
LOOP FILTER CONNECTION PIN | |||
LPF_CP_A, LPF_REF_A | 2, 1 | I/O, analog | Loop filter connection, place a 22 nF capacitor in series between LPF_CP_A and LPF_REF_A |
LPF_CP_B, LPF_REF_B | 17, 18 | I/O, analog | Loop filter connection, place a 22 nF capacitor in series between LPF_CP_B and LPF_REF_B |
Reference Clock I/O | |||
REFCLK_IN | 14 | I, LVCMOS | 25 MHz ±100 ppm clock from external Oscillator |
INDICATOR PINS | |||
LOCK | 16 | O, LVCMOS | Goes high when CDR lock is attained on the corresponding channel. Note that this terminal is shared with strap input functions read at startup |
LOS/INT# | 13 | O, OD | Output is driven LOW when a valid signal is present on CH A. Output is released when signal on CH A is lost (LOS). This output can be redefined as an INT# signal which will be driven LOW if the EOM check returns a value below the HEO/VEO interrupt threshold(2) |
SMBus MODE PINS | |||
ENSMB | 3 | I, 4-Level | System Management Bus (SMBus) enable terminal HIGH = Register Access, SMBus Slave mode FLOAT = SMBus Master read from External EEPROM LOW = External Pin Control Mode |
SDA | 4 | I, SMBus O, OD |
Data Input / Open Drain Output External pull-up resistor is required. Terminal is 3.3 V LVCMOS tolerant(3) |
SCL | 5 | I, SMBus O, OD |
Clock input in SMBus slave mode. Can also be an open drain output in SMBus master mode Pin is 3.3 V LVCMOS Tolerant(3) |
TX_DIS | 6 | I, 4-Level | Disable the OUTB transmitter HIGH = OUTA Enabled/OUTB Disabled FLOAT = Reserved 20K to GND = Reserved LOW = OUTA/OUTB Enabled (normal operation) |
ADDR0 | 16 | I, LVCMOS | This pin sets the SMBus address for the retimer. This pin is a strap input. The state is read on power-up to set the SMBus address in SMBus control mode(3) |
ADDR1/DONE# | 10 | IO, LVCMOS | This pin sets the SMBus address for the retimer in SMBus Slave Mode. Goes low to indicate that the SMBus master EEPROM read has been completed in SMBus Master Mode(3) |
READEN# | 9 | I, 4-Level | Initiates SMBus master EEPROM read. When multiple DS110DS111 are connected to a single EEPROM, the READEN# input can be daisy chained to the DONE# output. In SMBus Slave Mode, pull low to Logic 0 proper register operation(3) |
PIN CONTROL (ENSMB = LOW)(1) | |||
DEMA | 4 | I, 4-Level | Set CHA output de-emphasis level in pin control mode(3) |
DEMB | 5 | I, 4-Level | Set CHB output de-emphasis level in pin control mode(3) |
LBK | 6 | I, 4-Level | HIGH = INA goes to OUTA, INB goes to OUTB FLOAT = INB goes to OUTA and OUTB 20K to GND = INA goes to OUTA and OUTB LOW = INA goes to OUTB, INB goes to OUTA(3) |
VODA | 9 | I, 4-Level | Set CHA output launch amplitude in pin control mode(3) |
VODB | 10 | I, 4-Level | Set CHB output launch amplitude in pin control mode(3) |
POWER | |||
VDD | 21, 22 | Power | VDD = 2.5 V ±5% 3.3 V Mode Operation: VDD Supply Output = 2.5 V ±5% 2.5 V Mode Operation: VDD Supply Input = 2.5 V ±5% |
VIN | 15 | Power | Regulator Input with Integrated Supply Mode Control 3.3 V Mode Operation: VIN Supply Input = 3.3 V ±10% 2.5 V Mode Operation: VIN Supply Input = 2.5 V ±5% |
DAP | PAD | Power | Ground reference The exposed pad at the center of the package must be connected to ground plane of the board with at least 4 vias to lower the ground impedance and improve the thermal performance of the package |