SNOA961A February   2017  – February 2023 LDC2112 , LDC2114 , LDC3114 , LDC3114-Q1

 

  1.   Inductive Touch System Design Guide for HMI Button Applications
  2. 1Mechanical Design
    1. 1.1 Theory of Operation
    2. 1.2 Button Construction
    3. 1.3 Mechanical Deflection
    4. 1.4 Mechanical Factors that Affect Sensitivity
      1. 1.4.1 Target Material Selection
        1. 1.4.1.1 Material Stiffness
        2. 1.4.1.2 Material Conductivity
      2. 1.4.2 Button Geometry
      3. 1.4.3 Spacing Between Target and Sensor
    5. 1.5 Layer Stacks of Touch Buttons
      1. 1.5.1 Conductive Surface
      2. 1.5.2 Non-Conductive Surface
    6. 1.6 Sensor Mounting Reference
    7. 1.7 Sensor Mounting Techniques
      1. 1.7.1 Adhesive-Based
      2. 1.7.2 Spring-Based
      3. 1.7.3 Slot-Based
    8. 1.8 Mechanical Isolation
  3. 2Sensor Design
    1. 2.1 Overview
      1. 2.1.1 Sensor Electrical Parameters
      2. 2.1.2 Sensor Frequency
      3. 2.1.3 Sensor RP and RS
      4. 2.1.4 Sensor Inductance
      5. 2.1.5 Sensor Capacitance
      6. 2.1.6 Sensor Quality Factor
    2. 2.2 Inductive Touch
    3. 2.3 LDC211x/LDC3114 Design Boundary Conditions
    4. 2.4 Sensor Physical Construction
      1. 2.4.1 Sensor Physical Size
      2. 2.4.2 Sensor Capacitor Position
      3. 2.4.3 Shielding INn traces
      4. 2.4.4 Shielding Capacitance
      5. 2.4.5 CCOM Sizing
      6. 2.4.6 Multi-Layer Design
        1. 2.4.6.1 Sensor Parasitic Capacitance
      7. 2.4.7 Sensor Spacers
      8. 2.4.8 Sensor Stiffener
      9. 2.4.9 Racetrack Inductor Shape
    5. 2.5 Example Sensor
  4. 3Summary
  5. 4Revision History

2.4.5 CCOM Sizing

The COM pin can drive a load of up to 20 nF to ground. CCOM should be sized so that the following relationship is valid for all channels.

Equation 6. 100 × CSENSOR / QSENSOR < CCOM < 1250 × CSENSOR / QSENSOR

This requirement is still necessary even if CSENSOR is not the same value for all channels.