SNOAA47A September   2024  – October 2024 TMP116 , TMP117 , TMP119

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
  5. 2Sensor - Object Surface Thermal Resistance and the Importance for Measurement Precision
  6. 3Testing
    1. 3.1 Hardware Setup
    2. 3.2 Test Setup
    3. 3.3 Test Method
      1. 3.3.1 Measurement Results
  7. 4Thermal Parameters Calculations
  8. 5Summarizing and Interpreting Test Results
  9. 6Summary
  10. 7References
  11. 8Revision History

3.1 Hardware Setup

The purpose of the following measurements was to determine the thermal resistance values for the QFN and WCSP BGA packages of the TMP116, TMP117, and TMP119 soldered to PCB of varying thickness and composition.

The following parts and PCB were used during these tests:

  • Devices
    • TMP116 and TMP117 parts in the QFN-6 (DRV) package.
    • TMP119/TMP117 parts in the WCSP-6 (YBG) package.
  • Boards
    • Rigid PCB (11mm × 22mm) coupon boards with a thickness of 64 mils.
    • Rigid PCB (11mm × 22mm) coupon boards with a thickness of 32 mils.
    • Flex PCB (11mm × 22mm) coupon boards with a thickness of 6 mil.

3–4 coupon boards (CB) were tested for each case. During the test runs, QFN packaged parts were assembled to examine both the soldered and non-soldered thermal pad (TP) conditions. DRV and YBG Parts Coupon Boards Used in the Tests shows various example coupon boards used in the tests.

DRV and YBG Parts Coupon Boards Used in the Tests Figure 3-1 DRV and YBG Parts Coupon Boards Used in the Tests