Good PCB layout ensures superb performance. Figure 4-1 shows an effective layout using the LM3697 device.
- Place the CIN
and COUT capacitors and the Schottky diode close to the
LM3697, the power trace should be short and wide to decrease power
loss on the PCB trace.
- Place the L inductor
close to the LM3697.
- The width of the power
trace between the inductor and LM3697 should be 10 mil or more to
decrease the noise and power dissipation on the power trace, and
meanwhile optimize EMI performance.
- The width of the SW trace
must be more than 10 mil especially for the inner
layer or bottom layer, for the quantity of vias connected to the
inductor is no less than 3 to decrease dv/dt and improve EMI
performance.
- The width of the power
trace between CIN and COUT and the LM3697
should be more than 10 mil to decrease the noise and power
dissipation on the power trace, meanwhile this optimizes EMI
performance.
- The GND pin should be
connected to main ground plane (Brown color layer) directly to get
better thermal sink and better EMI performance.