SNOSDE5A December   2021  – May 2022 LM74502 , LM74502H

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Input Voltage
      2. 8.3.2 Charge Pump (VCAP)
      3. 8.3.3 Gate Driver (GATE, SRC)
        1. 8.3.3.1 Inrush Current Control
      4. 8.3.4 Enable (EN/UVLO)
      5. 8.3.5 Overvoltage Protection (OV)
    4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown Mode
      2. 8.4.2 Conduction Mode
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Design Considerations
        2. 9.2.2.2 MOSFET Selection
        3. 9.2.2.3 Overvoltage Protection
        4. 9.2.2.4 Charge Pump VCAP, Input and Output Capacitance
      3. 9.2.3 Application Curves
    3. 9.3 Input Surge Stopper Using LM74502, LM74502H
      1. 9.3.1 VS Capacitance, Resistor R1 and Zener Clamp (DZ)
      2. 9.3.2 Overvoltage Protection
      3. 9.3.3 MOSFET Selection
    4. 9.4 Fast Turn-On and Turn-Off High Side Switch Driver Using LM74502H
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) LM74502
LM74502H		 UNIT
DDF (SOT)
8 PINS
RθJA Junction-to-ambient thermal resistance 133.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 72.6 °C/W
RθJB Junction-to-board thermal resistance 54.5 °C/W
ΨJT Junction-to-top characterization parameter 4.6 °C/W
ΨJB Junction-to-board characterization parameter 54.2 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.