4 Summary

This application note highlights that increased PCB copper area improves the thermal performance (R_ΘJA) of LM5013. This enables more thermal margin in a given application, or higher output power capability, given that the PCB can better manage the power dissipation (heat). Additionally, it can be seen that additional losses occur in the buck topology other than that of power FET(s) which are integrated in a converter or module. In the LM5013-Q1EVM design, the buck inductor and diode both have non-negligible heat dissipation and constitute local temperature rise of the neighboring regulator.

Careful analysis and evaluation should be done to determine the impact of the components on thermal capability on the design. Please consult TI WEBENCH® or customer support channels such as E2E in the case you need further clarification on thermal design of a DC/DC, such as LM5013.