SNVSA37A October   2015  – May 2016 LM5175

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Simplified Schematic
  5. 5 Revision History
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Fixed Frequency Valley/Peak Current Mode Control with Slope Compensation
      2. 8.3.2  VCC Regulator and Optional BIAS Input
      3. 8.3.3  Enable/UVLO
      4. 8.3.4  Soft-Start
      5. 8.3.5  Overcurrent Protection
      6. 8.3.6  Average Input/Output Current Limiting
      7. 8.3.7  CCM/DCM Operation
      8. 8.3.8  Frequency and Synchronization (RT/SYNC)
      9. 8.3.9  Frequency Dithering
      10. 8.3.10 Output Overvoltage Protection (OVP)
      11. 8.3.11 Power Good (PGOOD)
      12. 8.3.12 Gm Error Amplifier
      13. 8.3.13 Integrated Gate Drivers
      14. 8.3.14 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown, Standby, and Operating Modes
      2. 8.4.2 MODE Pin Configuration
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1  Custom Design with WEBENCH Tools
        2. 9.2.2.2  Frequency
        3. 9.2.2.3  VOUT
        4. 9.2.2.4  Inductor Selection
        5. 9.2.2.5  Output Capacitor
        6. 9.2.2.6  Input Capacitor
        7. 9.2.2.7  Sense Resistor (RSENSE)
        8. 9.2.2.8  Slope Compensation
        9. 9.2.2.9  UVLO
        10. 9.2.2.10 Soft-Start Capacitor
        11. 9.2.2.11 Dither Capacitor
        12. 9.2.2.12 MOSFETs QH1 and QL1
        13. 9.2.2.13 MOSFETs QH2 and QL2
        14. 9.2.2.14 Frequency Compensation
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Custom Design with WEBENCH Tools
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Documentation Support
      1. 12.3.1 Related Documentation
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

12 Device and Documentation Support

12.1 Custom Design with WEBENCH Tools

Click here to create a custom design using the LM5175 device with the WEBENCH® Power Designer.

  1. Start by entering your VIN, VOUT and IOUT requirements.
  2. Optimize your design for key parameters like efficiency, footprint and cost using the optimizer dial and compare this design with other possible solutions from Texas Instruments.
  3. WEBENCH Power Designer provides you with a customized schematic along with a list of materials with real time pricing and component availability.
  4. In most cases, you will also be able to:
    • Run electrical simulations to see important waveforms and circuit performance,
    • Run thermal simulations to understand the thermal performance of your board,
    • Export your customized schematic and layout into popular CAD formats,
    • Print PDF reports for the design, and share your design with colleagues.
  5. Get more information about WEBENCH tools at www.ti.com/webench.

12.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

12.3 Documentation Support

12.3.1 Related Documentation

Please visit TI homepage for latest technical document including application notes, user guides, and reference designs.

IC Package Thermal Metrics application report, SPRA953.

12.4 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

12.5 Trademarks

PowerPAD, E2E are trademarks of Texas Instruments.

Webench, WEBENCH are registered trademarks of Texas Instruments.

All other trademarks are the property of their respective owners.

12.6 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

12.7 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.