SPRABJ8B September   2022  – November 2023 AM2631 , AM2631-Q1 , AM2632 , AM2632-Q1 , AM2634 , AM2634-Q1 , AM263P4 , AM263P4-Q1

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1 Introduction
    1. 1.1 Acronyms
  5. 2 Power
    1. 2.1 Discrete DC-DC Power Solution
    2. 2.2 Integrated PMIC Power Solution
    3. 2.3 Power Decoupling and Filtering
    4. 2.4 Power Consumption
    5. 2.5 Power Distribution Network
      1. 2.5.1 Simulations
        1. 2.5.1.1 Core Digital Power 1.2 V
        2. 2.5.1.2 Digital/Analog I/O Power 3.3 V
    6. 2.6 e-Fuse Power
  6. 3 Clocking
    1. 3.1 Crystal and Oscillator Input Options
    2. 3.2 Output Clock Generation
    3. 3.3 Crystal Selection and Shunt Capacitance
    4. 3.4 Crystal Placement and Routing
  7. 4 Resets
  8. 5 Bootstrapping
    1. 5.1 SOP Signal Implementation
    2. 5.2 OSPI/QSPI Memory Implementation
    3. 5.3 ROM OSPI/QSPI Boot Requirements
  9. 6 JTAG Emulators and Trace
  10. 7 Multiplexed Peripherals
  11. 8 Digital Peripherals
    1. 8.1 General Digital Peripheral Routing Guidelines
  12. 9 Analog Peripherals
    1. 9.1 General Analog Peripheral Routing Guidelines
      1. 9.1.1 Resolver ADC Routing Guidelines
  13. 10Layer Stackup
    1. 10.1 Key Stackup Features
  14. 11Vias
  15. 12BGA Power Fan-Out and Decoupling Placement
    1. 12.1 Ground Return
    2. 12.2 1.2 V Core Digital Power
      1. 12.2.1 Key Layout Considerations
    3. 12.3 3.3 V Digital and Analog Power
      1. 12.3.1 Key Layout Considerations
    4. 12.4 1.8 V Digital and Analog Power
      1. 12.4.1 Key Layout Considerations
  16. 13References
  17.   Revision History

12 BGA Power Fan-Out and Decoupling Placement

45 nm CMOS technology allows for faster core and SRAM clock rates, and faster edge rates for LVCMOS I/O buffers. Therefore, in comparison with previous MCU process nodes, careful power and ground return placement is critical to achieving best power integrity, signal integrity and EMI performance with AM263x and AM263Px designs.

It is recommended that designers follow a similar power distribution layout as implemented in the AM263x and AM263Px EVM PCB designs to achieve good power integrity results across all operating conditions and EMI testing conditions.

The TMDSCNCD263 controlCard EVM represents the most optimized and scrutinized power distribution layout example so far and so the controlCard is referenced in this section.