SPRABJ8B September   2022  – November 2023 AM2631 , AM2631-Q1 , AM2632 , AM2632-Q1 , AM2634 , AM2634-Q1 , AM263P4 , AM263P4-Q1

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1 Introduction
    1. 1.1 Acronyms
  5. 2 Power
    1. 2.1 Discrete DC-DC Power Solution
    2. 2.2 Integrated PMIC Power Solution
    3. 2.3 Power Decoupling and Filtering
    4. 2.4 Power Consumption
    5. 2.5 Power Distribution Network
      1. 2.5.1 Simulations
        1. 2.5.1.1 Core Digital Power 1.2 V
        2. 2.5.1.2 Digital/Analog I/O Power 3.3 V
    6. 2.6 e-Fuse Power
  6. 3 Clocking
    1. 3.1 Crystal and Oscillator Input Options
    2. 3.2 Output Clock Generation
    3. 3.3 Crystal Selection and Shunt Capacitance
    4. 3.4 Crystal Placement and Routing
  7. 4 Resets
  8. 5 Bootstrapping
    1. 5.1 SOP Signal Implementation
    2. 5.2 OSPI/QSPI Memory Implementation
    3. 5.3 ROM OSPI/QSPI Boot Requirements
  9. 6 JTAG Emulators and Trace
  10. 7 Multiplexed Peripherals
  11. 8 Digital Peripherals
    1. 8.1 General Digital Peripheral Routing Guidelines
  12. 9 Analog Peripherals
    1. 9.1 General Analog Peripheral Routing Guidelines
      1. 9.1.1 Resolver ADC Routing Guidelines
  13. 10Layer Stackup
    1. 10.1 Key Stackup Features
  14. 11Vias
  15. 12BGA Power Fan-Out and Decoupling Placement
    1. 12.1 Ground Return
    2. 12.2 1.2 V Core Digital Power
      1. 12.2.1 Key Layout Considerations
    3. 12.3 3.3 V Digital and Analog Power
      1. 12.3.1 Key Layout Considerations
    4. 12.4 1.8 V Digital and Analog Power
      1. 12.4.1 Key Layout Considerations
  16. 13References
  17.   Revision History

2.4 Power Consumption

This section outlines the latest estimates of the AM263x and AM263Px power consumption on a per device power net basis. These values may change as more power modeling and characterization is performed. This data can be used to scale peak DC-DC conversion power margin, perform IR drop analysis of the PCB layout, and help with thermal loading analysis.

These estimates are based on initial power simulations of the device when operating at 150°C junction temperature. For the latest characterized, peak power numbers, see the AM263x Sitara™ Microcontroller Data Sheet or AM263Px Sitara™ Microcontroller Data Sheet.

Also, a use-case based power estimation tool (PET) is provided for both the AM263x and AM263Px MCUs. These tools can help further bound the peak power based on specific core and peripheral utilization duty-cycle.

Table 2-2 AM263x and AM263Px Estimated Peak Power Consumption at 150°C Junction Temperature
Device Supply Nominal V Peak mA AM263 Peak mA AM263P Comment
VDD, VDDAR[3:1 ] 1.2 2500 2800 Digital core power
VDDS33 3.3 200 200 3.3 V digital I/O power
VDDA33 3.3 100 200 3.3 V analog I/O power