SPRACN9F May   2023  – August 2024 AM67 , AM67A , AM68 , AM68A , AM69 , AM69A , DRA821U , DRA821U-Q1 , DRA829J , DRA829J-Q1 , DRA829V , DRA829V-Q1 , TDA4AEN-Q1 , TDA4AH-Q1 , TDA4AL-Q1 , TDA4AP-Q1 , TDA4APE-Q1 , TDA4VE-Q1 , TDA4VEN-Q1 , TDA4VH-Q1 , TDA4VL-Q1 , TDA4VM , TDA4VM-Q1 , TDA4VP-Q1 , TDA4VPE-Q1

 

  1.   1
  2.   Jacinto7 AM6x/TDA4x/DRA8x LPDDR4 Design Guidelines
  3.   Trademarks
  4. 1Overview
    1. 1.1 Supporting Documentation
    2. 1.2 Board Designs Supported
    3. 1.3 General Board Layout Guidelines
    4. 1.4 PCB Stack-Up
    5. 1.5 Bypass Capacitors
      1. 1.5.1 Bulk Bypass Capacitors
      2. 1.5.2 High-Speed Bypass Capacitors
    6. 1.6 Velocity Compensation
  5. 2LPDDR4 Board Design and Layout Guidance
    1. 2.1  LPDDR4 Introduction
    2. 2.2  LPDDR4 Device Implementations Supported
    3. 2.3  LPDDR4 Interface Schematics
    4. 2.4  Compatible JEDEC LPDDR4 Devices
    5. 2.5  Placement
    6. 2.6  LPDDR4 Keepout Region
    7. 2.7  Net Classes
    8. 2.8  LPDDR4 Signal Termination
    9. 2.9  LPDDR4 VREF Routing
    10. 2.10 LPDDR4 VTT
    11. 2.11 CK, CMD_ADDR, and CTRL Topologies
    12. 2.12 Data Group Topologies
    13. 2.13 CK, CMD_ADDR, and CTRL Routing Specification
    14. 2.14 Data Group Routing Specification
    15. 2.15 Channel, Byte, and Bit Swapping
  6. 3LPDDR4 Board Design Simulations
    1. 3.1 Board Model Extraction
    2. 3.2 Board-Model Validation
    3. 3.3 S-Parameter Inspection
    4. 3.4 Time Domain Reflectometry (TDR) Analysis
    5. 3.5 Simulation Integrity Analysis
      1. 3.5.1 Simulation Setup
      2. 3.5.2 Simulation Parameters
      3. 3.5.3 Simulation Targets
        1. 3.5.3.1 Waveform Quality
        2. 3.5.3.2 Eye Quality
        3. 3.5.3.3 Delay Report
        4. 3.5.3.4 Mask Report
    6. 3.6 Design Example
      1. 3.6.1 Stack-Up
      2. 3.6.2 Routing
      3. 3.6.3 Model Verification
      4. 3.6.4 Simulation Results
  7. 4Revision History

2.1 LPDDR4 Introduction

LPDDR4 is an SDRAM device specification governed by the JEDEC standard JESD209-4, Low Power Double Data Rate 4 (LPDDR4). This standard strives to reduce power and improve signal integrity by implementing a lower voltage I/O power rail, employing ODT on the Command/Address bus, and reducing the overall width of the Command/Address bus, among other features. Unlike other DDR types, LPDDR4 has been organized into 2 × 16-bit channels. ECC is supported inline, thus a dedicated SDRAM for ECC is not required.

LPDDR4X is a variant of LPDDR4, with the difference of additional power savings by reducing the I/O voltage from 1.1 V to 0.6 V. It is possible LPDDR4 and LPDDR4X may be available in different packages and/or densities (outside scope of this document). LPDDR4X is currently not supported. It is possible support will be added at a future date, once additional validation efforts and data are collected.

The maximum supported rows for LPDDR4 devices is 17. The JEDEC standard was ratified in 2020, and increased the max number of rows from 17 to 18. As a result, certain high density parts that use byte-mode die and require 18 row bits are not supported.

ECC is supported on the LPDDR4 interface. Unlike traditional ECC interfaces which require dedicated memory pins and devices, ECC is supported inline. The ECC system impact is in interface bandwidth and overall memory density, as ECC data is stored alongside non-ECC data.

For increased memory bandwidths, some device may support multiple LPDDR interfaces. For these devices, the LPDDR interfaces (DDRSS0, DDRSS1, DDRSS2, and so forth) should always be used in incrementing order. For example, if a single LPDDR component is used it should be connected to DDR0_* interface. If two LPDDR components are used they should be connected to DDR0_* and DDR1_* interfaces. Three interfaces should use DDR0_*, DDR1_*, DDR2_*.

The following sections detail the routing specification and layout guidelines for an LPDDR4 interface.