For each C2000 device, the thermal characteristics and temperature specification limits are heavily documented. Systems and end products that exceed any of the data sheet’s recommended maximum power dissipation may require additional thermal dissipation incorporated into the design. The primary thermal consideration is the junction temperature (T_J). This specification should be carefully tested so that it remains in the absolute and recommended limits. Doing this will ensure reliable and function operation for the lifetime of the device. Another thermal consideration is the ambient temperature (T_A), though this varies depending on the end application environment and the product design.

To minimize T_J through the PCB board design, design the system such that the board-to-ambient thermal resistance (Θ_BA) is small. The GND and power pins are the primary method by which heat is dissipated out of the device. Thus, if the device has a thermal pad pin, be sure that it ties to a large copper area on the PCB. In most packages, the thermal pad will either be connected to GND inside the device or tied externally to GND. Likewise, ensure that any GND and power pads have a good connection to a solid plane and that any vias remain close to the C2000 device.

For more information on thermal metrics and definitions, see the Semiconductor and IC Package Thermal Metrics.