For proper signal routing, ensure that none of the traces bend at a 90° angle. While this is automatic in most PCB design software, confirming this property amongst all traces is good practice. Traces should be routed with a bend of at most 45°, or along a curve if possible. This reduces reflections and changes in characteristic impedance along the trace, leading to reduced radiation. This is because right angles cause increased capacitance in the region of the corner and thus impedance change, which moreover leads to reflections. Additionally, a good practice is to have the signals on adjacent layers cross perpendicular to each other (at a 90° angle). This can reduce crosstalk between the signals and ensure that disturbance between signals is minimized. Including ample spacing between traces can also reduce cross-talk, especially for signals with fast rise/fall times.

Certain signals on the board require thicker trace widths. Most notably, any power routes and high-current paths should use wide traces. Wide traces help to maintain a low-inductance path on these routes. This can help with reducing the voltage drops and power loss on these paths as well as reducing unwanted thermal dissipation.

When routing traces on a multi-layer board, oftentimes it is necessary to route signals on different layers. Vias are used to cross signals between different layers, but they should be used sparingly and only when necessary. Apart from creating holes throughout the planes on the board, these vias can also have negative impacts on the EMI produced by the board, especially for high-switching signals. Improved signal routing may be achieved by making modifications to the pinmux selection and schematic of the system. Reassigning pins can help in optimizing the trace routing and lead to shorter trace lengths and a reduced need for vias.

When using vias, an important consideration is whether to tent the vias. This practice offers many benefits but adds additional cost to board production. Tenting vias with solder mask offers corrosion protection to the vias and can reduce via degradation. On high-density boards, tented vias ease in the placement and readibility of silkscreen, as silkscreen does not stick to plain, un-tented vias. Additionally, the tent can help prevent any accidental shorts. For example, if a connector is placed over an un-tented via, an electrical short can be made. The ability to tent a via depends on the size of the via. Small vias are easier to fill than larger vias, and the feasibility of tenting large vias is dependent on the board manufacturer.