SPRAD13 May   2022 AM623 , AM625

 

  1.   Abstract
  2.   Trademarks
  3. 1 Introduction
  4. 2 Via Channel Arrays
  5. 3 Width/Spacing Proposal for Escapes
  6. 4 Stackup
  7. 5 Via Sharing
  8. 6 Floorplan Component Placement
  9. 7 Critical Interfaces Impact Placement
  10. 8 Routing Priority
  11. 9 SerDes Interfaces
  12. 10DDR Interfaces
  13. 11Power Decoupling
  14. 12Route Lowest Priority Interfaces Last
  15. 13Summary

1 Introduction

AM62x is an extension of the low-power, low-cost Sitara Industrial/Auto grade family of process. AM62x is based on the Cortex-A53 microprocessor, M4F microcontroller with dedicated peripherals, 3D graphics acceleration, dual display interfaces, extensive peripheral and networking options for a variety of embedded applications. AM62x is available in a 13mm x 13mm FBGA package with a 0.5mm ball pitch. The package BGA design is built leveraging TI Via Channel Array Technology (VCA) technology, which enables package miniaturization while still utilizing low cost PCB routing rules. Via Channel Array (VCA) is built with careful considerations on escape routing to avoid costly High-Density Interconnect (HDI) and expensive Via technologies. This document is intended to provide a reference for escape routing on the AM62x device. Care must be taken to route signals with special requirements such as DDR, high speed interfaces. Refer to the High-Speed Interface Layout Guidelines and AM62x DDR Routing Guidelines for more details. Details on Power Delivery Network are provided in AM62x PDN Application note and any routing and layout requirements specified in those documents supersede the generic requirements provided here.