SPRADI9 June   2024 AM623 , AM625

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
  5. 2Design-Based Approach
  6. 3Background
    1. 3.1 Process Delivery Kit (PDK)
    2. 3.2 SPICE Models for Circuit Behavior
    3. 3.3 Electronic Design Automation (EDA) Tools
    4. 3.4 Package Reliability
  7. 4Comparison of Design-Based Approach vs. HTOL Approach
  8. 5AM625/623 Lifetime Reliability Analysis Results
  9. 6Conclusion
  10. 7Revision History
  11.   A Appendix – The HTOL-Based Approach
  12.   B Appendix – The Mathematic Basis for EM Reliability Estimates

2 Design-Based Approach

HTOL-based testing for the purpose of product lifetime estimation presents some considerable challenges, particularly in terms of practical limitations on sample size and test duration, as well as the difficulty in achieving effective stress conditions for some salient failure mechanisms (notably electro-migration and hot carrier degradation). A fuller account of these issues is provided later in Comparison of Design-Based Approach vs. HTOL Approach for Lifetime Estimates and Appendix A, but a simple summary is provided in Figure 3. TI believes the design-based approach of estimating product lifetime is more accurate and reliable for Embedded Processors than the more typical HTOL approach, which is more common in the industry. The methodology and results of the design-based approach are detailed in this publication.

Table 2-1 High-level Assessment of Reliability Wear-out Mechanisms – HTOL vs. Design (EDA) Tools
Wearout Failure Mechanism Reliability Robustly Assessed?
HTOL EDA Tools
TDDB (inc. GOI, Drain Stress) Yes Yes
Aging- Biased Thermal Instability (BTI) Maybe (1) Yes
Aging - Channel Hot Carriers (CHC) No Yes
Electromigration - Metal/Via No Yes
(1) HTOL stress pattern and ATE program dependent
Note:

While the design-based reliability modeling discussed in this document is quantitatively and statistically-oriented, and is based on TI’s understanding of how a typical customer would use our products, it cannot predict all possible use scenarios and does not represent any guarantee that extends warranty periods under TI Standard Terms and Conditions of Sale.

While the package option plays a role in overall product reliability, the effects package failure mechanisms can vary substantially depending on the package technology and users’ environmental conditions, such as temperature cycling profile and humidity conditions. Such conditions can vary widely. TI product qualification results, including Board-Level Reliability Temperature Cycling, can provide a starting point for the user to estimate package reliability.