SPRADI9 June   2024 AM623 , AM625

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
  5. 2Design-Based Approach
  6. 3Background
    1. 3.1 Process Delivery Kit (PDK)
    2. 3.2 SPICE Models for Circuit Behavior
    3. 3.3 Electronic Design Automation (EDA) Tools
    4. 3.4 Package Reliability
  7. 4Comparison of Design-Based Approach vs. HTOL Approach
  8. 5AM625/623 Lifetime Reliability Analysis Results
  9. 6Conclusion
  10. 7Revision History
  11.   A Appendix – The HTOL-Based Approach
  12.   B Appendix – The Mathematic Basis for EM Reliability Estimates

6 Conclusion

The case for TI’s design-based reliability lifetime assessment approach has been presented, along with a comparison to the typical HTOL-based methodology. TI’s approach flexibly facilitates variation of temperature and voltage with an output of curves to target fail fractions. The target fail fractions can then be varied, and the effects of variation have been shown. In principle, the effects of frequency can also be comprehended, but these are dependent on where the highest current design components are in the design, which clock domain applies, and whether that particular clock domain is being scaled in frequency. Due to potential complexities introduced by these factors, frequency scaling has been omitted from this publication.