SPRUJ62 December   2022 AM69 , AM69A , TDA4AH-Q1 , TDA4AP-Q1 , TDA4VH-Q1 , TDA4VP-Q1

 

  1.   Trademarks
  2. 1Introduction
    1. 1.1 Inside the Box
    2. 1.2 Key Features and Interfaces
    3. 1.3 Thermal Compliance
    4. 1.4 Reach Compliance
    5. 1.5 EMC, EMI, and ESD Compliance
  3. 2User Interfaces
    1. 2.1 Power Input
      1. 2.1.1 Power Input [J7] [J3] with LED for Status [LD4][LD5]
      2. 2.1.2 Power Control [SW1] with LED for Status [LD7][LD8][LD9]
      3. 2.1.3 Power Budget Considerations
    2. 2.2 User Inputs
      1. 2.2.1 Board Configuration Settings [SW2] [SW4] [SW13] [SW16]
      2. 2.2.2 Boot Configuration Settings [SW7] [ SW11]
      3. 2.2.3 Reset Pushbuttons [SW9] [ SW10] [SW12] [SW14]
      4. 2.2.4 User Pushbuttons [SW3] [SW5] [SW6] [SW8] [SW15] with User LED Indication [LD2] [LD3]
    3. 2.3 Standard Interfaces
      1. 2.3.1 Uart-Over-USB [J48] [J49] with LED for Status [LD11] [LD12]
      2. 2.3.2 Gigabit Ethernet [J39] [J40] with Integrated LEDs for Status
      3. 2.3.3 USB3.1 Gen1 Interface [J4]
      4. 2.3.4 USB2.0 Interface [J5]
      5. 2.3.5 PCIe Card Slot [J14] [J17]
      6. 2.3.6 Display Port Interfaces [J8] [J9]
      7. 2.3.7 MicroSD Card Cage [J53]
      8. 2.3.8 Stereo Audio Interface [J29]
      9. 2.3.9 JTAG/Emulation Interface [J23] [J1]
    4. 2.4 Expansion Interfaces
      1. 2.4.1  Heatsink [ACC1] with Fan Header [J24]
      2. 2.4.2  CAN-FD Connectors [J41-J46]
      3. 2.4.3  LIN Connectors [J28]
      4. 2.4.4  Serial Ethernet Expansion Interfaces [J52] [J51]
      5. 2.4.5  Camera Interfaces [J55] [J57]
      6. 2.4.6  Automation and Control Connector [J50]
      7. 2.4.7  ADC [J27]
      8. 2.4.8  SPI [J26]
      9. 2.4.9  CSI-TX [J10]
      10. 2.4.10 Accessory Power Connector [J47]
  4. 3Circuit Details
    1. 3.1 Top Level Diagram
    2. 3.2 Interface Mapping
    3. 3.3 I2C Address Mapping
    4. 3.4 GPIO Mapping
    5. 3.5 Power Monitoring
    6. 3.6 Shared Interfaces / Signal Muxing
    7. 3.7 Power Delivery Network (PDN)
    8. 3.8 Identification EEPROM

1.3 Thermal Compliance

There is elevated heat on the processor/heatsink, use caution particularly at elevated ambient temperatures! Although the processor/heatsink is not a burn hazard, caution should be used when handling the EVM due to increased heat in the area of the heatsink.

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