In my two decades with DLP Products, I’ve seen a wide variety of applications benefit from the use of DLP technology. The migration from 2D Automated Optical Inspection (AOI) to 3D AOI for printed circuit board manufacturing and inspection is no exception. The continuing miniaturization of consumer electronics offers new opportunities to improve inspection methods, like 3D AOI tactics, that can equate to manufacturing cost savings. If you are an AOI equipment designer, you may not know that you can leverage DLP solutions to help create the robust, high-speed, high resolution, high precision 3D imaging system necessary for successful inspection of PCB solder paste, solder joints, and accurate component placements.
3D AOI and Solder Paste Inspection (SPI) methods can help detect defects early in the assembly process, and combined with final inspection, help assure quality and reliability in the PCB manufacturing process with lower manufacturing costs.
As consumer electronics continue to reduce in size, it drives component sizes to shrink and PCB land geometries to increase in density. These properties may require additional 3D AOI or SPI capabilities to adequately assure final product quality.
3D AOI and SPI provide benefits at multiple stations in a PCB assembly factory including:
Many 3D AOI systems use DLP technology to quickly project up to 400 pre-determined patterns across a small field-of-view (FOV) on the target PCB. Monochrome or color cameras mounted to the side capture each projected pattern as it is deformed by the z-axis surface variation of the PCB components. The 3D shapes of the components are then derived through geometric triangulation analysis. The result is a 3D point cloud that a processor can compare to a reference model of “desired” physical attributes. The processor can then determine if any FOV contains attributes outside the expected norm, logs them as a fail condition, and provides the user the fail condition and location. Using this type of 3D structured light capability provides flexible, high precision 3D scanning to enable high speed inline inspection.
DLP technology brings many enhancements to AOI applications. For example, the DLP6500 digital micromirror device (DMD) is a 1920 x 1080 array of individually controlled mirrors which provides the high resolution, fast pattern rates, and programmability necessary for next generation 3D AOI applications. When coupled with the DLPC900 Controller, the two provide the following benefits:
DLP Products has a proven track record of MEMS technology leadership spanning more than 20 years. Multiple DMD resolutions and sizes support tiered AOI product positioning based on various scan speeds, resolutions, and price. In addition, our DLP Design Network provides expertise in designing and manufacturing solutions based on DLP technology in order to make product development easier and help customers accelerate their design process.
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