SWRA465A August   2014  – July 2015 CC2530 , CC2530 , CC2530-RF4CE , CC2530-RF4CE , CC2592 , CC2592

 

  1.   Using CC2592 Front End With CC2530
    1.     Trademarks
    2. 1  Introduction
    3. 2  Acronyms Used in This Documents
    4. 3  Absolute Maximum Ratings
    5. 4  Electrical Specifications
      1. 4.1 Operating Conditions
      2. 4.2 Current Consumption
      3. 4.3 Receive Parameters
      4. 4.4 Received Signal Strength Indicator (RSSI)
      5. 4.5 Transmit Parameters
      6. 4.6 Output Power Programming
      7. 4.7 Typical Performance Curves
      8. 4.8 IEEE - Transmit Power Spectral Density (PSD) Mask
    6. 5  Application Circuit
      1. 5.1 Power Decoupling
      2. 5.2 Input /Output Matching and Filtering
      3. 5.3 Bias Resistor
      4. 5.4 Antenna Considerations
    7. 6  PCB Layout Considerations
      1. 6.1 The Gain of the CC2592
    8. 7  Regulatory Requirements
      1. 7.1 Compliance of FCC Part 15.247 When Using the CC2530 With the CC2592
    9. 8  Controlling the CC2592
    10. 9  Integrating CC2592 With Z-Stack and TIMAC
    11. 10 References
  2.   A Marker - Delta Method
    1.     A.1
  3.   Revision History

6 PCB Layout Considerations

The SimpleLink™ ZigBee® Network Range Extender Reference Design[3] uses a 4-layer PCB solution with each layer having a different thickness.

The top layer is used for components and signal routing, and the open areas are filled with metallization connected to ground using several vias. The areas under the two chips are used for grounding and must be well connected to the ground plane with multiple vias. Footprint recommendation for the CC2592 is provided in the CC2592: CC2592 2.4-GHz Range Extender Data Manual (SWRS159) [2].

Layer two is a complete ground plane and is not used for routing. This ensures short return paths for RF currents. The low impedance of the ground plane prevents any unwanted signal coupling between any of the nodes that are decoupled to it. A dedicated ground plane is also needed to improve stability. Layer three is a power and signal routing plane. The power plane ensures low impedance traces at radio frequencies and prevents unwanted radiation from power traces. Layer four is used for routing, and like layer one, open areas are filled with metallization connected to ground using several vias.

NOTE

Changes in the PCB stack-up, component value, vendor sizes, or placements may affect the performance of the CC2530 and CC2592 solution. Any change may cause higher current consumption, unwanted spurious emissions, and generally degraded performance. Follow the reference design as closely as possible in order to obtain the best performance.