TIDUEB8C July   2018  – March 2021 TPS274160

 

  1.   Description
  2.   Resources
  3.   Features
  4.   Applications
  5.   5
  6. 1System Description
    1. 1.1 Key System Specifications
  7. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Highlighted Products
      1. 2.2.1 LM5165
      2. 2.2.2 TLC59282
      3. 2.2.3 TPS4H160-Q1
      4. 2.2.4 INA253
      5. 2.2.5 TIOL111
    3. 2.3 System Design Theory
      1. 2.3.1 IO-Link PHY
      2. 2.3.2 Current Sink
      3. 2.3.3 Power Supply for L+
      4. 2.3.4 Power Supply
      5. 2.3.5 Pinouts
    4. 2.4 Software Frame Handler
      1. 2.4.1 PRU-ICSS IO-Link Frame-Handler
        1. 2.4.1.1 Performance Advantages and Benefits
        2. 2.4.1.2 Principle of Operation
  8. 3Hardware, Software, Testing Requirements, and Test Results
    1. 3.1 Required Hardware and Software
      1. 3.1.1 Hardware
      2. 3.1.2 Software
    2. 3.2 Testing and Results
      1. 3.2.1 Test Setup
      2. 3.2.2 Test Results
        1. 3.2.2.1 IO-Link Wake-Up Pulse
        2. 3.2.2.2 L+ Turnon Behavior
        3. 3.2.2.3 Current Sink on CQ
        4. 3.2.2.4 Residue Voltage
        5. 3.2.2.5 IO-Link Physical Layer Test Summary
        6. 3.2.2.6 Current Sense on Each Port
        7. 3.2.2.7 TPS4H160 Thermal Behavior
  9. 4Design Files
    1. 4.1 Schematics
    2. 4.2 Bill of Materials
    3. 4.3 PCB Layout Recommendations
      1. 4.3.1 Layout Prints
    4. 4.4 Altium Project
    5. 4.5 Gerber Files
    6. 4.6 Assembly Drawings
  10. 5Software Files
  11. 6Related Documentation
    1. 6.1 Trademarks
  12. 7About the Author
  13. 8Revision History

3.2.2.7 TPS4H160 Thermal Behavior

The TPS4H160 device is loaded with 1 A per port and all 8 ports are switched on. Figure 3-14 shows the thermal image of the board at room temperature. The design is also able to handle 1 A without overheating at 85 °C ambient temperature.

GUID-3D04D007-981F-4D0C-BAF9-76FC7FBFCD2C-low.pngFigure 3-14 IO-Link® Master Thermal Image at 1-A Load per Port