TIDUES0E June   2019  – April 2024 TMS320F28P550SG , TMS320F28P550SJ , TMS320F28P559SJ-Q1

 

  1.   1
  2.   Description
  3.   Resources
  4.   Features
  5.   Applications
  6.   6
  7. 1System Description
    1. 1.1 Key System Specifications
  8. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Highlighted Products
      1. 2.2.1  UCC21710
      2. 2.2.2  UCC14141-Q1
      3. 2.2.3  AMC1311
      4. 2.2.4  AMC1302
      5. 2.2.5  OPA320
      6. 2.2.6  AMC1306M05
      7. 2.2.7  AMC1336
      8. 2.2.8  TMCS1133
      9. 2.2.9  TMS320F280039C
      10. 2.2.10 TLVM13620
      11. 2.2.11 ISOW1044
      12. 2.2.12 TPS2640
    3. 2.3 System Design Theory
      1. 2.3.1 Dual Active Bridge Analogy With Power Systems
      2. 2.3.2 Dual-Active Bridge – Switching Sequence
      3. 2.3.3 Dual-Active Bridge – Zero Voltage Switching (ZVS)
      4. 2.3.4 Dual-Active Bridge - Design Considerations
        1. 2.3.4.1 Leakage Inductor
        2. 2.3.4.2 Soft Switching Range
        3. 2.3.4.3 Effect of Inductance on Current
        4. 2.3.4.4 Phase Shift
        5. 2.3.4.5 Capacitor Selection
          1. 2.3.4.5.1 DC-Blocking Capacitors
        6. 2.3.4.6 Switching Frequency
        7. 2.3.4.7 Transformer Selection
        8. 2.3.4.8 SiC MOSFET Selection
      5. 2.3.5 Loss Analysis
        1. 2.3.5.1 SiC MOSFET and Diode Losses
        2. 2.3.5.2 Transformer Losses
        3. 2.3.5.3 Inductor Losses
        4. 2.3.5.4 Gate Driver Losses
        5. 2.3.5.5 Efficiency
        6. 2.3.5.6 Thermal Considerations
  9. 3Circuit Description
    1. 3.1 Power Stage
    2. 3.2 DC Voltage Sensing
      1. 3.2.1 Primary DC Voltage Sensing
      2. 3.2.2 Secondary DC Voltage Sensing
        1. 3.2.2.1 Secondary Side Battery Voltage Sensing
    3. 3.3 Current Sensing
    4. 3.4 Power Architecture
      1. 3.4.1 Auxiliary Power Supply
      2. 3.4.2 Gate Driver Bias Power Supply
      3. 3.4.3 Isolated Power Supply for Sense Circuits
    5. 3.5 Gate Driver Circuit
    6. 3.6 Additional Circuitry
    7. 3.7 Simulation
      1. 3.7.1 Setup
      2. 3.7.2 Running Simulations
  10. 4Hardware, Software, Testing Requirements, and Test Results
    1. 4.1 Required Hardware and Software
      1. 4.1.1 Hardware
      2. 4.1.2 Software
        1. 4.1.2.1 Getting Started With Software
        2. 4.1.2.2 Pin Configuration
        3. 4.1.2.3 PWM Configuration
        4. 4.1.2.4 High-Resolution Phase Shift Configuration
        5. 4.1.2.5 ADC Configuration
        6. 4.1.2.6 ISR Structure
    2. 4.2 Test Setup
    3. 4.3 PowerSUITE GUI
    4. 4.4 LABs
      1. 4.4.1 Lab 1
      2. 4.4.2 Lab 2
      3. 4.4.3 Lab 3
      4. 4.4.4 Lab 4
      5. 4.4.5 Lab 5
      6. 4.4.6 Lab 6
      7. 4.4.7 Lab 7
    5. 4.5 Test Results
      1. 4.5.1 Closed-Loop Performance
  11. 5Design Files
    1. 5.1 Schematics
    2. 5.2 Bill of Materials
    3. 5.3 Altium Project
    4. 5.4 Gerber Files
    5. 5.5 Assembly Drawings
  12. 6Related Documentation
    1. 6.1 Trademarks
  13. 7Terminology
  14. 8About the Author
  15. 9Revision History

1.1 Key System Specifications

Table 1-1 lists some of the critical design specifications of the dual-active-bridge (DAB) DC/DC converter. The system has a full load efficiency of 97.6% at an output power of 10 kW.

Table 1-1 Key System Specifications
PARAMETERSPECIFICATIONSDETAILS
Input voltage range700–800-V DCSection 3.1
Output voltage range250–500-V DCSection 3.1
Output power rating10-kW maximumSection 2.3.5
Output current26-A maximumSection 2.3.5
EfficiencyPeak 98.8% (at 4 kW) full load 98.0% (at 10 kW)Section 4.5
PWM switching frequency100 kHzSection 2.3.4.6
Power density> 2 kW/LSection 4.5
Voltage ripple< 5 %Section 2.3.4.5

Table 1-1 shows that the input voltage range is between 700 V and 800 V. This range was considered because the DC/DC converter must interface with the front-end Vienna rectifier and the three-phase power factor correction (PFC), which has an output that is within this range. This converter can also be used in conjunction with single-phase PFC systems with an output that is in the range of 400 V, which must interface with 48- and 72-V batteries.

TIDA-010054
CAUTION:

Do not leave the design powered when unattended.
TIDA-010054
WARNING:

High voltage! Accessible high voltages are present on the board. Electric shock is possible. The board operates at voltages and currents that can cause shock, fire, or injury if not properly handled. Use the equipment with necessary caution and appropriate safeguards to avoid injuring yourself or damaging property. For safety, use of isolated test equipment with overvoltage and overcurrent protection is highly recommended.

TI considers it the responsibility of the user to confirm that the voltages and isolation requirements are identified and understood before energizing the board or simulation. When energized, do not touch the design or components connected to the design.
TIDA-010054
WARNING:

Hot surface! Contact can cause burns. Do not touch!

Some components can reach high temperatures > 55°C when the board is powered on. Do not touch the board at any point during operation or immediately after operating, as high temperatures can be present.
TIDA-010054
WARNING:

TI intends this reference design to be operated in a lab environment only and does not consider the design as a finished product for general consumer use. The design is intended to be run at ambient room temperature and is not tested for operation under other ambient temperatures.

TI intends this reference design to be used only by qualified engineers and technicians familiar with risks associated with handling high-voltage electrical and mechanical components, systems, and subsystems.

There are accessible high voltages present on the board. The board operates at voltages and currents that can cause shock, fire, or injury if not properly handled or applied. Use the equipment with necessary caution and appropriate safeguards to avoid injuring yourself or damaging property.