TIDUF17 November   2022 TMS320F2800152-Q1 , TMS320F2800153-Q1 , TMS320F2800154-Q1 , TMS320F2800155 , TMS320F2800155-Q1 , TMS320F2800156-Q1 , TMS320F2800157 , TMS320F2800157-Q1

 

  1.   Description
  2.   Resources
  3.   Features
  4.   Applications
  5.   5
  6. 1System Description
  7. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Design Considerations
    3. 2.3 Highlighted Products
      1. 2.3.1 TMS320F280039C
      2. 2.3.2 UCC21530-Q1
      3. 2.3.3 OPA607-Q1
      4. 2.3.4 LM25184-Q1
      5. 2.3.5 TCAN1044A-Q1
    4. 2.4 System Design Theory
      1. 2.4.1 Three-Phase PMSM Drive
      2. 2.4.2 Field Oriented Control of PM Synchronous Motor
      3. 2.4.3 Field Weakening (FW) and Maximum Torque Per Ampere (MTPA) Control
      4. 2.4.4 Compressor Drive with Automatic Vibration Compensation
      5. 2.4.5 Hardware Prerequisites for Motor Drive
        1. 2.4.5.1 Motor Current Feedback
          1. 2.4.5.1.1 Current Sensing with Three-Shunt
          2. 2.4.5.1.2 Current Sensing with Single-Shunt
        2. 2.4.5.2 Motor Voltage Feedback
  8. 3Hardware, Software, Testing Requirements, and Test Results
    1. 3.1 Hardware Requirements
      1. 3.1.1 Hardware Board Overview
      2. 3.1.2 Test Conditions
      3. 3.1.3 Test Equipment Required for Board Validation
    2. 3.2 Test Setup
      1. 3.2.1 Hardware Setup
      2. 3.2.2 Software Setup
        1. 3.2.2.1 Code Composer Studio Project
        2. 3.2.2.2 Software Structure
    3. 3.3 Test Procedure
      1. 3.3.1 Level 1 Incremental Build
        1. 3.3.1.1 Project Setup
        2. 3.3.1.2 Running the Application
      2. 3.3.2 Level 2 Incremental Build
        1. 3.3.2.1 Project Setup
        2. 3.3.2.2 Running the Application
      3. 3.3.3 Level 3 Incremental Build
        1. 3.3.3.1 Project Setup
        2. 3.3.3.2 Running the Application
      4. 3.3.4 Level 4 Incremental Build
        1. 3.3.4.1 Project Setup
        2. 3.3.4.2 Running the Application
        3. 3.3.4.3 Tuning Field Weakening and MTPA Control
        4. 3.3.4.4 Tuning Vibration Compensation
        5. 3.3.4.5 CAN FD Command Interface
    4. 3.4 Test Results
      1. 3.4.1 MCU CPU Load, Memory, and Peripheral Usage
  9. 4Design and Documentation Support
    1. 4.1 Design Files
      1. 4.1.1 Schematics
      2. 4.1.2 BOM
    2. 4.2 Tools and Software
    3. 4.3 Documentation Support
    4. 4.4 Support Resources
    5. 4.5 Trademarks

3.1.1 Hardware Board Overview

Figure 3-1 shows an overview of a typical eCompressor drive system.

Figure 3-1 Hardware Board Block Diagram of TIDM-02012

The motor control board has functional groups that enable a complete motor drive system. The following is a list of the blocks on the board and their functions, Figure 3-2 shows the top view of the board and different blocks of the TIDM-02012 PCB.

  • DC bus input
    • DC bus input connector
    • 10 uF film capacitor rated for 1.3 kV
  • 3-phase inverter for eCompressor motor
    • Up to 5 kW 3-phase inverter supports PMSM or IPM
    • 15 kHz switching frequency
    • 3-shunt / single shunt for current sensing
    • Amplify and input filters for the analog signals
  • Control
    • TMS320F28039C MCU controlCARD
    • 100 MHz 32-bit CPU with FPU and TMU
  • Auxiliary power supply
    • On-board power supply to generate isolated +6 V, and +16 V. The +6V is then drived to +5V and +3.3V via LDO to power the controlCARD and control circuits.
GUID-20221117-SS0I-GGSD-8ZRW-RD1DBSXW7LLM-low.pngFigure 3-2 The Layout of eCompressor Reference Design Board
Note:

Although the TMS320F280039C controlCARD only takes one 120-pin HSEC connector, we reserved the 180-pin HSEC connector for compatibility with future devices.

TI recommends taking the following precautions when using the board:

  • Do not touch any part of the board or components connected to the board when the board is energized.
  • Use the AC Mains/wall power supply to power the kit. TI recommends an isolation AC source.
  • Do not touch any part of the board, the kit or its assembly when energized. (Though the power module heat sink is isolated from the board, high-voltage switching generates some capacitive coupled voltages over the heat sink body.)
  • Control Ground can be hot.