In-package magnetic current sensors like the TMCS1123 are an invasive style of current measurement, where several amps of current are passed through the device via a non-magnetic lead frame, resulting in thermal losses internal to the package. These losses are typically layout and printed circuit board dependent, as additional copper helps to extract power from the package, and mitigate the overall thermal response of the system. This paper examines a use case over a small sample size of TMCS1123's for both copper thickness, as well as copper area on a PCB to examine how these copper reinforcements may help mitigate thermal response in an application.
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