DATA SHEET
LMT89 2.4-V, 10-µA, SC70 Temperature Sensor
1 Features
2 Applications
- Industrial
- HVAC
- Automotive
- Disk Drives
- Portable Medical Instruments
- Computers
- Battery Management
- Printers
- Power Supply Modules
- FAX Machines
- Mobile Phones
- Automotive
3 Description
The LMT89 device is a precision analog output CMOS integrated-circuit temperature sensor that operates over a −55°C to 130°C temperature range. The power supply operating range is 2.4 V to 5.5 V. The transfer function of LMT89 device is predominately linear, yet has a slight predictable parabolic curvature. The accuracy of the LMT89 device, when specified to a parabolic transfer function, is typically ±1.5°C at an ambient temperature of 30°C. The temperature error increases linearly and reaches a maximum of ±2.5°C at the temperature range extremes. The temperature range is affected by the power supply voltage. At a power supply voltage of 2.7 V to 5.5 V, the temperature range extremes are 130°C and −55°C. Decreasing the power supply voltage to 2.4 V changes the negative extreme to −30°C, while the positive remains at 130°C.
The quiescent current of the LMT89 device is less than 10 μA. Therefore, self-heating is less than 0.02°C in still air. Shutdown capability for the LMT89 device is intrinsic because its inherent low power consumption allows it to be powered directly from the output of many logic gates or does not necessitate shutdown at all.
The LMT89 device is a cost-competitive alternative to thermistors.
Device Information(1)
| PART NUMBER | PACKAGE | BODY SIZE (NOM) |
|---|---|---|
| LMT89 | SOT (5) | 2.00 mm × 1.25 mm |
- For all available packages, see the orderable addendum at the end of the datasheet.
Simplified Schematic
Output Voltage vs Temperature
4 Revision History
Changes from * Revision (March 2013) to A Revision
- Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo
5 Pin Configuration and Functions
SC70-5 Top View
Pin Functions
| PIN | I/O | DESCRIPTION | |
|---|---|---|---|
| NO. | NAME | ||
| 1 | NC | — | NC (pin 1) must be left floating or grounded. Other signal traces must not be connected to this pin. |
| 2 | GND | GND | Device substrate and die attach paddle, connect to power supply negative terminal. For optimum thermal conductivity to the PC board ground plane, pin 2 must be grounded. This pin may also be left floating. |
| 3 | VO | Analog Output | Temperature sensor analog output |
| 4 | V+ | Power | Positive power supply pin |
| 5 | GND | GND | Device ground pin, connect to power supply negative terminal. |
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)(3)| MIN | MAX | UNIT | ||
|---|---|---|---|---|
| Supply Voltage | −0.2 | 6.5 | V | |
| Output Voltage | (V+ + 0.6 V) | −0.6 | V | |
| Output Current | 10 | mA | ||
| Input Current at any pin(2) | 5 | mA | ||
| Maximum Junction Temperature (TJMAX) | 150 | °C | ||
| Storage temperature (Tstg) | −65 | 150 | °C | |
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) When the input voltage (VI) at any pin exceeds power supplies (VI < GND or VI > V+), the current at that pin should be limited to 5 mA.
(3) Soldering process must comply with the Reflow Temperature Profile specifications. Refer to http://www.ti.com/packaging.. Reflow temperature profiles are different for lead-free and non-lead-free packages.
6.2 ESD Ratings
| VALUE | UNIT | |||
|---|---|---|---|---|
| V(ESD)(3) | Electrostatic discharge | Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) | ±2500 | V |
| Charged-device model (CDM), per JEDEC specification JESD22-C101(2) | ±250 | |||
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
(3) Accuracy is defined as the error between the measured and calculated output voltage at the specified conditions of voltage, current, and temperature (expressed in°C).
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)| MIN | MAX | UNIT | ||
|---|---|---|---|---|
| LMT89 with 2.4 V ≤ V+ ≤ 2.7 V | −30 | 130 | °C | |
| LMT89 with 2.7 V ≤ V+ ≤ 5.5 V | −55 | 130 | °C | |
| Supply Voltage Range (V+) | 2.4 | 5.5 | V | |
6.4 Thermal Information
| THERMAL METRIC(1) | LMT89 | UNIT | |
|---|---|---|---|
| SOT | |||
| 5 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 282 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 93 | |
| RθJB | Junction-to-board thermal resistance | 62 | |
| ψJT | Junction-to-top characterization parameter | 1.6 | |
| ψJB | Junction-to-board characterization parameter | 62 | |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | — | |
6.5 Electrical Characteristics
Unless otherwise noted, these specifications apply for V+ = 2.7 VDC. All limits TA = TJ = TMIN to TMAX, unless otherwise noted.| PARAMETER | TEST CONDITIONS | MIN(2) | TYP(1) | MAX(2) | UNIT |
|---|---|---|---|---|---|
| Temperature to Voltage Error VO = (−3.88 × 10−6× T2) + (−1.15 × 10−2 × T) + 1.8639 V(3) |
–2.5 | ±1.5 | 2.5 | °C | |
| Output Voltage at 0°C | 1.8639 | V | |||
| Variance from Curve | ±1.0 | °C | |||
| Non-Linearity (4) | –20°C ≤ TA ≤ 80°C | ±0.4% | |||
| Sensor Gain (Temperature Sensitivity or Average Slope) to equation: VO = −11.77 mV/°C × T + 1.860 V |
–30°C ≤ TA ≤ 100°C | –12.2 | –11.77 | –11.4 | mV/°C |
| Output Impedance | Sourcing IL 0 μA to 16 μA (6)(7) | 160 | Ω | ||
| Load Regulation(5) | Sourcing IL 0 μA to 16 μA (6)(7) | –2.5 | mV | ||
| Line Regulation(8) | 2.4 V ≤ V+ ≤ 5.0 V | 3.3 | mV/V | ||
| 5.0 V ≤ V+ ≤ 5.5 V | 11 | mV | |||
| Quiescent Current | 2.4V ≤ V+ ≤ 5.0 V; TA = 25°C | 4.5 | 7 | μA | |
| 5.0V ≤ V+ ≤ 5.5 V; TA = 25°C | 4.5 | 9 | μA | ||
| 2.4V ≤ V+ ≤ 5.0 V | 4.5 | 10 | μA | ||
| Change of Quiescent Current | 2.4 V ≤ V+ ≤ 5.5 V | 0.7 | μA | ||
| Temperature Coefficient of Quiescent Current | –11 | nA/°C | |||
| Shutdown Current | V+ ≤ 0.8 V | 0.02 | μA |
(1) Typical values are at TJ = TA = 25°C and represent most likely parametric norm.
(2) Limits are specified to TI's AOQL (Average Outgoing Quality Level).
(3) Accuracy is defined as the error between the measured and calculated output voltage at the specified conditions of voltage, current, and temperature (expressed in°C).
(4) Non-Linearity is defined as the deviation of the calculated output-voltage-versus-temperature curve from the best-fit straight line, over the temperature range specified.
(5) Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output due to heating effects can be computed by multiplying the internal dissipation by the thermal resistance.
(6) The LMT89 can at most sink 1 μA and source 16 μA.
(7) Load regulation or output impedance specifications apply over the supply voltage range of 2.4 V to 5.5 V.
(8) Line regulation is calculated by subtracting the output voltage at the highest supply input voltage from the output voltage at the lowest supply input voltage.
6.6 Typical Characteristics
