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  • MSPM0G110x Mixed-Signal Microcontrollers

    • SLASF11C February   2023  – October 2023 MSPM0G1106 , MSPM0G1107

      PRODUCTION DATA  

  • CONTENTS
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  • MSPM0G110x Mixed-Signal Microcontrollers
  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagrams
    2. 6.2 Pin Attributes
    3. 6.3 Signal Descriptions
    4. 6.4 Connections for Unused Pins
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Supply Current Characteristics
      1. 7.5.1 RUN/SLEEP Modes
      2. 7.5.2 STOP/STANDBY Modes
      3. 7.5.3 SHUTDOWN Mode
    6. 7.6  Power Supply Sequencing
      1. 7.6.1 POR and BOR
      2. 7.6.2 Power Supply Ramp
    7. 7.7  Flash Memory Characteristics
    8. 7.8  Timing Characteristics
    9. 7.9  Clock Specifications
      1. 7.9.1 System Oscillator (SYSOSC)
        1. 7.9.1.1 SYSOSC Typical Frequency Accuracy
      2. 7.9.2 Low Frequency Oscillator (LFOSC)
      3. 7.9.3 System Phase Lock Loop (SYSPLL)
      4. 7.9.4 Low Frequency Crystal/Clock
      5. 7.9.5 High Frequency Crystal/Clock
    10. 7.10 Digital IO
      1. 7.10.1 Electrical Characteristics
      2. 7.10.2 Switching Characteristics
    11. 7.11 Analog Mux VBOOST
    12. 7.12 ADC
      1. 7.12.1 Electrical Characteristics
      2. 7.12.2 Switching Characteristics
      3. 7.12.3 Linearity Parameters
      4. 7.12.4 Typical Connection Diagram
    13. 7.13 Temperature Sensor
    14. 7.14 VREF
      1. 7.14.1 Voltage Characteristics
      2. 7.14.2 Electrical Characteristics
    15. 7.15 GPAMP
      1. 7.15.1 Electrical Characteristics
      2. 7.15.2 Switching Characteristics
    16. 7.16 I2C
      1. 7.16.1 I2C Timing Diagram
      2. 7.16.2 I2C Characteristics
      3. 7.16.3 I2C Filter
    17. 7.17 SPI
      1. 7.17.1 SPI
      2. 7.17.2 SPI Timing Diagram
    18. 7.18 UART
    19. 7.19 TIMx
    20. 7.20 Emulation and Debug
      1. 7.20.1 SWD Timing
  9. 8 Detailed Description
    1. 8.1  CPU
    2. 8.2  Operating Modes
      1. 8.2.1 Functionality by Operating Mode (MSPM0G110x)
    3. 8.3  Power Management Unit (PMU)
    4. 8.4  Clock Module (CKM)
    5. 8.5  DMA
    6. 8.6  Events
    7. 8.7  Memory
      1. 8.7.1 Memory Organization
      2. 8.7.2 Peripheral File Map
      3. 8.7.3 Peripheral Interrupt Vector
    8. 8.8  Flash Memory
    9. 8.9  SRAM
    10. 8.10 GPIO
    11. 8.11 IOMUX
    12. 8.12 ADC
    13. 8.13 Temperature Sensor
    14. 8.14 VREF
    15. 8.15 GPAMP
    16. 8.16 CRC
    17. 8.17 UART
    18. 8.18 I2C
    19. 8.19 SPI
    20. 8.20 WWDT
    21. 8.21 RTC
    22. 8.22 Timers (TIMx)
    23. 8.23 Device Analog Connections
    24. 8.24 Input/Output Diagrams
    25. 8.25 Serial Wire Debug Interface
    26. 8.26 Bootstrap Loader (BSL)
    27. 8.27 Device Factory Constants
    28. 8.28 Identification
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Typical Application
      1. 9.1.1 Schematic
  11. 10Device and Documentation Support
    1. 10.1 Getting Started and Next Steps
    2. 10.2 Device Nomenclature
    3. 10.3 Tools and Software
    4. 10.4 Documentation Support
    5. 10.5 Support Resources
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Glossary
  12. 11Mechanical, Packaging, and Orderable Information
  13. 12Revision History
  14. IMPORTANT NOTICE

Package Options

Mechanical Data (Package|Pins)
  • PM|64
    • MTQF008B
  • PT|48
    • MTQF003C
  • RGE|24
    • MPQF124G
  • DGS|28
    • MPSS139
  • RGZ|48
    • MPQF123F
  • RHB|32
    • MPQF130D
Thermal pad, mechanical data (Package|Pins)
  • RGE|24
    • QFND136Y
  • RGZ|48
    • QFND014T
  • RHB|32
    • QFND029X
Orderable Information
  • slasf11c_oa
  • slasf11c_pm
search No matches found.
  • Full reading width
    • Full reading width
    • Comfortable reading width
    • Expanded reading width
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  • Card with all content

 

Data Sheet

MSPM0G110x Mixed-Signal Microcontrollers

1 Features

  • Core
    • Arm® 32-bit Cortex®-M0+ CPU with memory protection unit, frequency up to 80 MHz
  • Operating characteristics
    • Extended temperature: –40°C up to 105°C
    • Wide supply voltage range: 1.62 V to 3.6 V
  • Memories
    • Up to 128KB of flash memory with built-in error correction code (ECC)
    • Up to 32KB of SRAM with hardware parity
  • High-performance analog peripherals
    • Two simultaneous sampling 12-bit 4-Msps analog-to-digital converters (ADCs) with up to 17 external channels
      • 14-bit effective resolution at 250-ksps with hardware averaging
    • One general-purpose amplifier (GPAMP)
    • Configurable 1.4-V or 2.5-V internal shared voltage reference (VREF)
    • Integrated temperature sensor
    • Integrated supply monitor
  • Optimized low-power modes
    • RUN: 96 µA/MHz (CoreMark)
    • SLEEP: 467 µA at 4 MHz
    • STOP: 46 µA at 32 kHz
    • STANDBY: 1.5 µA with RTC and SRAM retention
    • SHUTDOWN: 80 nA with IO wakeup capability
  • Intelligent digital peripherals
    • 7-channel DMA controller
    • Two 16-bit advanced control timers support dead band insertion and fault handling
    • Seven timers supporting up to 22 PWM channels
      • One 16-bit general purpose timer
      • One 16-bit general purpose timer supports QEI
      • Two 16-bit general-purpose timers support low-power operation in STANDBY mode
      • One 32-bit general-purpose timer
      • Two 16-bit advanced timers with deadband
    • Two window-watchdog timers
    • RTC with alarm and calendar mode
  • Enhanced communication interfaces
    • Four UART interfaces; one supports LIN, IrDA, DALI, Smart Card, Manchester, and three support low-power operation in STANDBY mode
    • Two I2C interfaces supporting up to FM+ (1 Mbit/s), SMBus, PMBus, and wakeup from STOP mode
    • Two SPIs, one SPI supports up to 32 Mbits/s
  • Clock system
    • Internal 4- to 32-MHz oscillator with up to ±3% accuracy (SYSOSC) across temperature
    • Phase-locked loop (PLL) up to 80 MHz
    • Internal 32-kHz oscillator (LFOSC)
    • External 4- to 48-MHz crystal oscillator (HFXT)
    • External 32-kHz crystal oscillator(LFXT)
    • External clock input
  • Data integrity and encryption
    • Cyclic redundancy checker (CRC-16, CRC-32)
  • Flexible I/O features
    • Up to 60 GPIOs
      • Two 5-V tolerant IOs
      • Two high-drive IOs with 20-mA drive strength
  • Development support
    • 2-pin serial wire debug (SWD)
  • Package options
    • 64-pin LQFP
    • 48-pin LQFP , VQFN
    • 32-pin VQFN
    • 28-pin VSSOP
    • 24-pin VQFN
  • Family members (also see Device Comparison)
    • MSPM0G1105: 32KB flash, 16KB RAM
    • MSPM0G1106: 64KB flash, 32KB RAM
    • MSPM0G1107: 128KB flash, 32KB RAM
  • Development kits and software (also see Tools and Software)
    • LP-MSPM0G3507 LaunchPad™ development kit
    • MSP Software Development Kit (SDK)

 
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