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  • TPS65132 Single Inductor - Dual Output Power Supply

    • SLVSBM1H June   2013  – November 2016 TPS65132

      UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA.  

  • CONTENTS
  • SEARCH
  • TPS65132 Single Inductor - Dual Output Power Supply
  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5  Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 I2C Interface Timing Requirements / Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Undervoltage Lockout (UVLO)
      2. 8.3.2 Active Discharge
      3. 8.3.3 Boost Converter
        1. 8.3.3.1 Boost Converter Operation
        2. 8.3.3.2 Power-Up And Soft-Start (Boost Converter)
        3. 8.3.3.3 Power-Down (Boost Converter)
        4. 8.3.3.4 Isolation (Boost Converter)
        5. 8.3.3.5 Output Voltage (Boost Converter)
        6. 8.3.3.6 Advanced Power-Save Mode For Light-Load Efficiency And PFM
      4. 8.3.4 LDO Regulator
        1. 8.3.4.1 LDO Operation
        2. 8.3.4.2 Power-Up And Soft-Start (LDO)
        3. 8.3.4.3 Power-Down And Discharge (LDO)
        4. 8.3.4.4 Isolation (LDO)
        5. 8.3.4.5 Setting The Output Voltage (LDO)
      5. 8.3.5 Negative Charge Pump
        1. 8.3.5.1 Operation
        2. 8.3.5.2 Power-Up And Soft-Start (CPN)
        3. 8.3.5.3 Power-Down And Discharge (CPN)
        4. 8.3.5.4 Isolation (CPN)
        5. 8.3.5.5 Setting The Output Voltage (CPN)
    4. 8.4 Device Functional Modes
      1. 8.4.1 Enabling and Disabling the Device
    5. 8.5 Programming
      1. 8.5.1 I2C Serial Interface Description
      2. 8.5.2 I2C Interface Protocol
    6. 8.6 Register Maps
      1. 8.6.1 Registers
        1. 8.6.1.1 VPOS Register - Address: 0x00
        2. 8.6.1.2 VNEG Register - Address 0x01
        3. 8.6.1.3 DLYx Register - Address 0x02 (Only valid for TPS65132Sx)
        4. 8.6.1.4 APPS - SEQU - SEQD - DISP - DISN Register - Address 0x03
        5. 8.6.1.5 Control Register - Address 0xFF
      2. 8.6.2 Factory Default Register Value
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Low-current Applications (≤ 40 mA)
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Sequencing
          2. 9.2.1.2.2 Boost Converter Design Procedure
            1. 9.2.1.2.2.1 Inductor Selection (Boost Converter)
            2. 9.2.1.2.2.2 Input Capacitor Selection (Boost Converter)
            3. 9.2.1.2.2.3 Output Capacitor Selection (Boost Converter)
          3. 9.2.1.2.3 Input Capacitor Selection (LDO)
          4. 9.2.1.2.4 Output Capacitor Selection (LDO)
          5. 9.2.1.2.5 Input Capacitor Selection (CPN)
          6. 9.2.1.2.6 Output Capacitor Selection (CPN)
          7. 9.2.1.2.7 Flying Capacitor Selection (CPN)
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Mid-current Applications (≤ 80 mA)
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
          1. 9.2.2.2.1 Boost Converter Design Procedure
            1. 9.2.2.2.1.1 Inductor Selection (Boost Converter)
            2. 9.2.2.2.1.2 Input Capacitor Selection (Boost Converter)
            3. 9.2.2.2.1.3 Output Capacitor Selection (Boost Converter)
          2. 9.2.2.2.2 Input Capacitor Selection (LDO)
          3. 9.2.2.2.3 Output Capacitor Selection (LDO)
          4. 9.2.2.2.4 Input Capacitor Selection (CPN)
          5. 9.2.2.2.5 Output Capacitor Selection (CPN)
          6. 9.2.2.2.6 Flying Capacitor Selection (CPN)
        3. 9.2.2.3 Application Curves
      3. 9.2.3 High-current Applications (≤ 150 mA)
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedure
          1. 9.2.3.2.1 Sequencing
          2. 9.2.3.2.2 SYNC = HIGH
          3. 9.2.3.2.3 Startup
        3. 9.2.3.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 CSP Package Summary
      1. 13.1.1 Chip Scale Package Dimensions
      2. 13.1.2 RVC Package Summary
  14. IMPORTANT NOTICE

Package Options

Mechanical Data (Package|Pins)
  • RVC|20
    • MPQF234A
  • YFF|15
    • MXBG163C
Thermal pad, mechanical data (Package|Pins)
Orderable Information
  • slvsbm1h_oa
  • slvsbm1h_pm
search No matches found.
  • Full reading width
    • Full reading width
    • Comfortable reading width
    • Expanded reading width
  • Card for each section
  • Card with all content

 

DATA SHEET

TPS65132 Single Inductor - Dual Output Power Supply

1 Features

  • Input Voltage Range: 2.5 V to 5.5 V
  • VPOS Boost Converter:
    4 V to 6 V (0.1-V step)
  • VNEG Inverting Buck-Boost Converter:
    –6 V to –4 V (0.1-V step)
  • Maximum Output Current:
    80 mA or 150 mA
  • Outstanding Combined Efficiency
    • > 85% at IOUT > 10 mA
    • > 90% at IOUT > 40 mA
  • Excellent Performance
    • Outstanding Transient Response
    • 1% Output Voltage Accuracy over
      Full Temperature Range
  • I2C Interface
    • Programmable Power-Up / -Down
      Sequencing Options
    • Flexible Output Voltage Programming
    • Programmable Active Output Discharge
    • > 1000x Programmable Non-Volatile Memory
  • Under-Voltage Lock-Out and Thermal Protection
  • Two Package Options
    • 15-Ball CSP Package
    • 20-Pins QFN Package

2 Applications

  • Small-, Medium-Size Bipolar LCD Displays
    • Smartphone, Tablet
    • Camera, GPS
    • Home Automation, Point-of-Sales
    • Wearables (Smart Watch, Activity Tracker)
  • General Split-Rail Power Supply
    • Differential Audio, Headphone Amplifier
    • Instrumentation, Operational Amplifier, Comparator
    • DAC / ADC

3 Description

The TPS65132 family is designed to supply positive/negative driven applications. The device uses a single inductor scheme for both outputs to provide the user smallest solution size, a small bill-of-material as well as high efficiency. The devices offer best line and load regulation at low noise. With its input voltage range of 2.5 V to 5.5 V, it is optimized for products powered by single-cell batteries (Li-Ion, Ni-Li, Li-Polymer) and fixed 3.3-V and 5-V rails. The TPS656132 family provides 80 mA and 150 mA output current options with programmability to 40 mA. There are both CSP and QFN package options available.

Device Information (1)

PART NUMBER PACKAGE BODY SIZE (NOM.)
TPS65132
-B, -L, -T, -S		 DSBGA (15) 2.11 mm × 1.51 mm
TPS65132W WQFN (20) 4.00 mm × 3.00 mm
  1. For all available packages, see the orderable addendum at the end of the datasheet.

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Typical Application

TPS65132 typ_app_slvsbm1.gif

Efficiency vs Output Current

TPS65132 C003_SLVSBM1.png

4 Revision History

Changes from G Revision (August 2015) to H Revision

  • Removed Product Preview from TPS65132S.Go
  • Changed Device Comparison Table Go
  • Added description of clock stretching Go
  • Deleted detailed I2C interface description Go
  • Added that the DLYx Register is only valid for TPS65132Sx versions. Go
  • Changed Table 6 Go

Changes from F Revision (June 2015) to G Revision

  • Changed scope figures for Boost Converter switching. Go

Changes from E Revision (November 2014) to F Revision

  • Added TPS65132L1 device to Device Comparison table Go
  • Added TPS65132T6 device to the Device Comparison Table. Go
  • Separated LOGIC SCL, SDA spec MIN/MAX from LOGIC EN, ENN, ENP, SYNC spec MIN/MAXGo
  • Changed DAC Registers section for clarity Go
  • Added High-current Applications (≤ 150 mA) sectionGo

Changes from D Revision (October 2014) to E Revision

  • Added TPS65132L0 device to Device Comparison table Go

Changes from C Revision (July 2014) to D Revision

  • Changed package type to industry standard identifier in the Device Information table Go

Changes from B Revision (May 2014) to C Revision

  • Added note to Device Comparison Table Go
  • Added reference to Power-Down And Discharge (LDO) and Power-Down And Discharge (CPN) Go
  • Added Table 1 and various references to itGo
  • Added "Power-Down And Discharge (CPN) shows the VNEG discharge behavior of each device variant".Go
  • Added Table 2 and various references to it Go
  • Added note to Figure 18 Go

Changes from A Revision (August 2013) to B Revision

  • Formatted to the new data sheet standard Go
  • Added new package option (QFN) to Device Information table Go
  • Added new package option (QFN) to Pin Configurations section Go
  • Added the ESD Ratings table Go

Changes from * Revision (June 2013) to A Revision

  • Added TPS65132Bx devices to the Device Comparison tableGo

5 Device Comparison Table

PART NUMBER(1) PRE-PROGRAMMED
OUTPUT VOLTAGES		 IOUT_MAX PRE-PROGRAMMED
IOUT		 PRE-PROGRAMMED
ACTIVE DISCHARGE(2)		 STARTUP TIME
VPOS / VNEG (4)		 ISD PACKAGE
TPS65132A VPOS = 5.4 V
VNEG = –5.4 V		 80 mA 40 mA VPOS / VNEG FAST 30 µA CSP
TPS65132A0 VPOS = 5.0 V
VNEG = –5.0 V
TPS65132B VPOS = 5.4 V
VNEG = –5.4V		 80 mA 40 mA VPOS / VNEG FAST 130 nA CSP
TPS65132B0 VPOS = 5.0 V
VNEG = –5.0 V
TPS65132B5 VPOS = 5.5 V
VNEG = –5.5 V
TPS65132B2 VPOS = 5.2 V
VNEG = –5.2 V		 80 mA 40 mA VPOS / VNEG SLOW 130 nA CSP
TPS65132L VPOS = 5.4 V
VNEG = –5.4 V
TPS65132L0 VPOS = 5.0 V
VNEG = –5.0 V
TPS65132L1 (3) VPOS = 5.1 V
VNEG = –5.1 V		 80 mA 40 mA VPOS / VNEG SLOW 130 nA CSP
TPS65132T6 VPOS = 5.6 V
VNEG = –5.6 V		 80 mA 80 mA VPOS / VNEG SLOW 130 nA CSP
TPS65132S VPOS = 5.4 V
VNEG = –5.4 V		 150 mA 80 mA VPOS / VNEG SLOW 130 nA CSP
TPS65132W VPOS = 5.4 V
VNEG = –5.4 V		 80 mA 80 mA VPOS / VNEG SLOW 130 nA QFN
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com
(2) See Power-Down And Discharge (LDO) and Power-Down And Discharge (CPN) for a detailed description of how each device variant implements the active discharge function.
(3) Product preview.
(4) Please refer to Power-Up And Soft-Start (LDO) and Power-Up And Soft-Start (CPN) for more details.

 
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