AFE3256

ACTIVE

256-channel analog front end (AFE) for dynamic and semi-dynamic X-ray flat-panel detectors

Product details

Number of input channels 256 Resolution (Bits) 16 Features Internal Reference Buffer, Nap Mode, Power Down, X-ray Interface type SPI/LVDS Operating temperature range (°C) 0 to 70 Rating Catalog
Number of input channels 256 Resolution (Bits) 16 Features Internal Reference Buffer, Nap Mode, Power Down, X-ray Interface type SPI/LVDS Operating temperature range (°C) 0 to 70 Rating Catalog
COF (TFU) 320 1064 mm² 38 x 28 COF (TFV) 315 831.84 mm² 48 x 17.33
  • 256 channels
  • On-chip, 16-bit ADC
  • High performance:
    • Noise: 440 electrons RMS (1.2-pC input charge range)
    • Low correlated noise
    • Full-channel integral nonlinearity: ±2 LSB at 16 bit
    • Scan time: < 16 µs to 204.8 µs
  • Integration:
    • Programmable full-scale input charge range: 0.3pC to 12.5pC with resolution of 0.3pC
    • Internal timing generator (TG)
    • Built-in correlated double sampler
    • Software programmable electron or hole integration mode
    • Pipelined integrate-and-read for improved throughput—data-read during integration
    • Serial LVDS output
    • On-chip temperature sensor
  • Simple power supply scheme:
    • Single 1.85V power supply operation
  • Multiple power modes with power consumption ranging from 1mW/ch to 2mW/ch
  • Power-down modes: sleep and standby
  • Binning mode support
  • Custom chip-on-film (COF) packages
  • 256 channels
  • On-chip, 16-bit ADC
  • High performance:
    • Noise: 440 electrons RMS (1.2-pC input charge range)
    • Low correlated noise
    • Full-channel integral nonlinearity: ±2 LSB at 16 bit
    • Scan time: < 16 µs to 204.8 µs
  • Integration:
    • Programmable full-scale input charge range: 0.3pC to 12.5pC with resolution of 0.3pC
    • Internal timing generator (TG)
    • Built-in correlated double sampler
    • Software programmable electron or hole integration mode
    • Pipelined integrate-and-read for improved throughput—data-read during integration
    • Serial LVDS output
    • On-chip temperature sensor
  • Simple power supply scheme:
    • Single 1.85V power supply operation
  • Multiple power modes with power consumption ranging from 1mW/ch to 2mW/ch
  • Power-down modes: sleep and standby
  • Binning mode support
  • Custom chip-on-film (COF) packages

The AFE3256 is a 256-channel, analog front-end (AFE) designed to suit the requirements of flat-panel detector (FPD) based digital X-ray systems. The device includes 256 integrators, correlated double samplers (CDSs) with dual banking, and 256:2 analog multiplexers. The device also features two 16-bit successive-approximation register (SAR) analog-to-digital converters (ADCs). Serial data from the ADCs are available in low-voltage differential signaling (LVDS) format.

The device, also commonly referred to as a readout integrated circuit (ROIC), optimizes the overall system performance using features such as multiple power modes and in-system debug options.

The sleep and standby modes enable substantial power saving which is critical for battery-powered systems.

The AFE3256 is a 256-channel, analog front-end (AFE) designed to suit the requirements of flat-panel detector (FPD) based digital X-ray systems. The device includes 256 integrators, correlated double samplers (CDSs) with dual banking, and 256:2 analog multiplexers. The device also features two 16-bit successive-approximation register (SAR) analog-to-digital converters (ADCs). Serial data from the ADCs are available in low-voltage differential signaling (LVDS) format.

The device, also commonly referred to as a readout integrated circuit (ROIC), optimizes the overall system performance using features such as multiple power modes and in-system debug options.

The sleep and standby modes enable substantial power saving which is critical for battery-powered systems.

Download View video with transcript Video
Request more information

The full data sheet is available. Request now

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 3
Type Title Date
* Data sheet AFE3256 256-Channel, Analog Front-End for Digital X-Ray, Flat-Panel Detectors datasheet (Rev. A) PDF | HTML 24 Apr 2024
Certificate AFE3256EVM EU Declaration of Conformity (DoC) 18 Sep 2023
Analog Design Journal Selecting a multichannel ultra-low-current measurement IC PDF | HTML 18 Mar 2022

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

AFE3256EVM — AFE3256 evaluation module for 256-channel analog front end (AFE) for X-ray flat-panel detectors

The AFE3256 evaluation module (EVM) is used to evaluate the AFE3256 device, a low-power, low-noise charge readout IC (charge to digital converter) in chip-on-flex (COF) package. The EVM comprises an analog board, which seamlessly integrates with the TSWDC155EVM (FPGA EVM) for data capture. The EVM (...)

Driver or library

AFE3256-DESIGN AFE3256 design files

AFE3256 datasheet, COF package drawings, EVM GUI/user guide and other design resources
Supported products & hardware

Supported products & hardware

Products
Digital X-ray AFEs
AFE3256 256-channel analog front end (AFE) for dynamic and semi-dynamic X-ray flat-panel detectors
Simulation tool

PSPICE-FOR-TI — PSpice® for TI design and simulation tool

PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
Package Pins CAD symbols, footprints & 3D models
COF (TFU) 320 Ultra Librarian
COF (TFV) 315 Ultra Librarian

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Recommended products may have parameters, evaluation modules or reference designs related to this TI product.

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos