XAM62P54AUMHAAMH OBSOLETE

Processor Cores:

• Up to Quad 64-bit Arm Cortex-A53 microprocessor subsystem at up to 1.4GHz
  • Quad-core Cortex-A53 cluster with 512KB L2 shared cache with SECDED ECC
  • Each A53 core has 32KB L1 DCache with SECDED ECC and 32KB L1 ICache with Parity protection
• Single-core Arm Cortex-R5F at up to 800MHz, integrated as part of MCU Channel with FFI
  • 32KB ICache, 32KB L1 DCache, and 64KB TCM with SECDED ECC on all memories
  • 512KB SRAM with SECDED ECC
• Single-core Arm Cortex-R5F at up to 800MHz, integrated to support Device Management
  • 32KB ICache, 32KB L1 DCache, and 64KB TCM with SECDED ECC on all memories

Multimedia:

• Display subsystem
  • Triple display support over OLDI (LVDS) (1x OLDI-DL, 1x or 2x OLDI-SL), DSI or DPI
    • OLDI-SL (Single Link): up to 1920 x 1080 at 60fps (165MHZ Pixel Clock)
    • OLDI-DL (Dual Link): up to 3840 x 1080 at 60fps (150MHz Pixel Clock)
    • MIPI DSI: with 4 Lane MIPI® D-PHY supports up to 3840 x 1080 at 60fps (300MHz Pixel Clock)
    • DPI (24-bit RGB parallel interface): up to 1920 x 1080 at 60fps (165MHz pixel clock)
  • Four display pipelines with hardware overlay support. A maximum of two display pipelines may be used per display.
  • Supports safety features such as freeze frame detection and data correctness check
• 3D Graphics Processing Unit
  • IMG BXS-4-64 with 256KB cache
  • Up to 50GFLOPS
  • Single shader core
  • OpenGL ES3.2 and Vulkan 1.2 API support
• One Camera Serial Interface (CSI-2) Receiver with 4 Lane D-PHY
  • MIPI® CSI-2 v1.3 Compliant + MIPI D-PHY 1.2
  • Support for 1,2,3 or 4 data lane mode up to 2.5Gbps per lane
  • ECC verification/correction with CRC check + ECC on RAM
  • Virtual Channel support (up to 16)
  • Ability to write stream data directly to DDR via DMA
• Video Encoder/Decoder
  • Support for HEVC (H.265) Main profiles at Level 5.1 High-tier
  • Support for H.264 BaseLine/Main/High Profiles at Level 5.2
  • Support for up to 4K UHD resolution (3840 × 2160)
    • Up to 300MPixels/s operation, with reduced clocking options available for lower power applications with lower performance needs

Memory Subsystem:

• Up to 1.09MB of On-chip RAM
  • 64KB of On-Chip RAM (OCRAM) with SECDED ECC, can be divided into smaller banks in increments of 32KB for as many as 2 separate memory banks
  • 256KB of On-Chip RAM with SECDED ECC in SMS Subsystem
  • 176KB of On-Chip RAM with SECDED ECC in SMS Subsystem for TI security firmware
  • 512KB of On-chip RAM with SECDED ECC in Cortex-R5F MCU Subsystem
  • 64KB of On-chip RAM with SECDED ECC in Device Manager Subsystem
• DDR Subsystem (DDRSS)
  • Supports LPDDR4 memory type
  • 32-bit data bus with inline ECC
  • Supports speeds up to 3733MT/s
  • Max size of 8GB

Functional Safety:

• Functional Safety-Compliant targeted [Industrial]
  • Developed for functional safety applications
  • Documentation will be available to aid IEC 61508 functional safety system design
  • Systematic capability up to SIL 3 targeted
  • Hardware Integrity up to SIL 2 targeted
  • Safety-related certification
    • IEC 61508 by TÜV SÜD planned
• Functional Safety-Compliant targeted [Automotive]
  • Developed for functional safety applications
  • Documentation will be available to aid ISO 26262 functional safety system design
  • Systematic capability up to ASIL D targeted
  • Hardware integrity up to ASIL B targeted
  • Safety-related certification
    • ISO 26262 by TÜV SÜD planned
• AEC - Q100 qualified [Automotive]

Security:

• Secure boot supported
  • Hardware-enforced Root-of-Trust (RoT)
  • Support to switch RoT via backup key
  • Support for takeover protection, IP protection, and anti-roll back protection
• Trusted Execution Environment (TEE) supported
  • Arm TrustZone based TEE
  • Extensive firewall support for isolation
  • Secure watchdog/timer/IPC
  • Secure storage support
  • Replay Protected Memory Block (RPMB) support
• Dedicated Security Controller with user programmable HSM core and dedicated security DMA & IPC subsystem for isolated processing
• Cryptographic acceleration supported
  • Session-aware cryptographic engine with ability to auto-switch key-material based on incoming data stream
    • Supports cryptographic cores
  • AES – 128-/192-/256-Bit key sizes
  • SHA2 – 224-/256-/384-/512-Bit key sizes
  • DRBG with true random number generator
  • PKA (Public Key Accelerator) to Assist in RSA/ECC processing for secure boot
• Debugging security
  • Secure software controlled debug access
  • Security aware debugging

High-Speed Interfaces:

• Integrated Ethernet switch supporting (total 2 external ports)
  • RMII(10/100) or RGMII (10/100/1000)
  • IEEE1588 (Annex D, Annex E, Annex F with 802.1AS PTP)
  • Clause 45 MDIO PHY management
  • Packet Classifier based on ALE engine with 512 classifiers
  • Priority based flow control
  • Time Sensitive Networking (TSN) support
  • Four CPU H/W interrupt Pacing
  • IP/UDP/TCP checksum offload in hardware
• Two USB2.0 Ports
  • Port configurable as USB host, USB peripheral, or USB Dual-Role Device (DRD mode)
  • Integrated USB VBUS detection

General Connectivity:

• 9x Universal Asynchronous Receiver-Transmitters (UART)
• 5x Serial Peripheral Interface (SPI) controllers
• 6x Inter-Integrated Circuit (I2C) ports
• 3x Multichannel Audio Serial Ports (McASP)
  • Transmit and Receive Clocks up to 50MHz
  • Up to 4/6/16 Serial Data Pins across 3x McASP with Independent TX and RX Clocks
  • Supports Time Division Multiplexing (TDM), Inter-IC Sound (I2S), and Similar Formats
  • Supports Digital Audio Interface Transmission (SPDIF, IEC60958-1, and AES-3 Formats)
  • FIFO Buffers for Transmit and Receive (256 Bytes)
  • Support for audio reference output clock
• 3x enhanced PWM modules (ePWM)
• 3x enhanced Quadrature Encoder Pulse modules (eQEP)
• 3x enhanced Capture modules (eCAP)
• General-Purpose I/O (GPIO), All LVCMOS I/O can be configured as GPIO
• 4x Controller Area Network (CAN) modules with CAN-FD support
  • Conforms w/ CAN Protocol 2.0 A, B and ISO 11898-1
  • Full CAN-FD support (up to 64 data bytes)
  • Parity/ECC check for Message RAM
  • Speed up to 8Mbps

Media and Data Storage:

• 3x Multi-Media Card/Secure Digital (MMC/SD/SDIO) interfaces
  • 1x 8-bit eMMC interface up to:
    • HS200 for non-Q1 devices
    • HS400 for Q1 devices
  • 2x 4-bit SD/SDIO interfaces up to UHS-I
  • Compliant with eMMC 5.1, SD 3.0, and SDIO Version 3.0
• 1× General-Purpose Memory Controller (GPMC) up to 133MHz
  • Flexible 8- and 16-bit Asynchronous Memory Interface with up to four Chip (22-bit address) Selects (NAND, NOR, Muxed-NOR, and SRAM)
  • Uses BCH code to support 4-, 8-, or 16-bit ECC
  • Uses Hamming code to support 1-bit ECC
  • Error Locator Module (ELM)
    • Used with the GPMC to locate addresses of data errors from syndrome polynomials generated using a BCH algorithm
    • Supports 4-, 8-, and 16-bit per 512-Byte block error location based on BCH algorithms
• OSPI/QSPI with DDR / SDR support
  • Support for Serial NAND and Serial NOR Flash devices
  • 4GBytes memory address support
  • XIP mode with optional on-the-fly encryption

Power Management:

• Low-power modes supported by Device Manager:
  • Partial IO support for CAN/GPIO/UART wakeup
  • I/O Only + DDR in Self Refresh for Suspend to RAM
  • DeepSleep
  • MCU Only
  • Standby
  • Dynamic frequency scaling

Optimal Power Management Solution:

• Recommended TI Power Management ICs (PMIC)
  • Supports up to Automotive ASIL-B functional safety when powering the AEC – Q100 qualified AM62P-Q1 device
  • Supports up to SIL-2 functional safety industrial applications when powering the AM62P device
  • Companion PMIC is specially designed to meet power supply requirements
  • Flexible mapping and factory programmed configurations to support different use cases

Boot Options:

• UART
• I2C EEPROM
• OSPI/QSPI Flash
• GPMC NOR/NAND Flash
• SD Card
• eMMC
• USB (host) Mass storage
• USB (device) boot from external host (DFU mode)
• Ethernet

Technology / Package:

• 16nm FinFET technology
• 17mm x 17mm, 0.65/0.8mm pitch with VCA, 466-pin FCBGA