Home Power management Power stages Si power stages

CSD97396Q4M

ACTIVE

30A Synchronous Buck NexFET Power Stage

Product details

VDS (V) 30 Ploss current (A) 15 Rating Catalog Operating temperature range (°C) -40 to 150
VDS (V) 30 Ploss current (A) 15 Rating Catalog Operating temperature range (°C) -40 to 150
VSON-CLIP (DPC) 8 15.75 mm² 4.5 x 3.5
  • Over 93% System Efficiency at 15 A
  • Max Rated Continuous Current 30 A, Peak 65 A
  • High Frequency Operation (up to 2 MHz)
  • High Density – SON 3.5 mm × 4.5 mm Footprint
  • Ultra-Low Inductance Package
  • System-Optimized PCB Footprint
  • Ultra-Low Quiescent (ULQ) Current Mode
  • 3.3 V and 5 V PWM Signal Compatible
  • Diode Emulation Mode With FCCM
  • Input Voltages up to 24 V
  • Tri-State PWM Input
  • Integrated Bootstrap Diode
  • Shoot-Through Protection
  • RoHS Compliant – Lead Free Terminal Plating
  • Halogen Free
  • Over 93% System Efficiency at 15 A
  • Max Rated Continuous Current 30 A, Peak 65 A
  • High Frequency Operation (up to 2 MHz)
  • High Density – SON 3.5 mm × 4.5 mm Footprint
  • Ultra-Low Inductance Package
  • System-Optimized PCB Footprint
  • Ultra-Low Quiescent (ULQ) Current Mode
  • 3.3 V and 5 V PWM Signal Compatible
  • Diode Emulation Mode With FCCM
  • Input Voltages up to 24 V
  • Tri-State PWM Input
  • Integrated Bootstrap Diode
  • Shoot-Through Protection
  • RoHS Compliant – Lead Free Terminal Plating
  • Halogen Free

The CSD97396Q4M NexFET Power Stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and NexFET technology to complete the power stage switching function. The driver IC has a built-in selectable diode emulation function that enables DCM operation to improve light load efficiency. In addition, the driver IC supports ULQ mode that enables connected standby for Windows 8. With the PWM input in tri-state, quiescent current is reduced to 130 µA, with immediate response. When SKIP# is held at tri-state, the current is reduced to 8 µA (typically 20 µs is required to resume switching). This combination produces a high current, high efficiency, and high speed switching device in a small 3.5 × 4.5 mm outline package. In addition, the PCB footprint is optimized to help reduce design time and simplify the completion of the overall system design.

The CSD97396Q4M NexFET Power Stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and NexFET technology to complete the power stage switching function. The driver IC has a built-in selectable diode emulation function that enables DCM operation to improve light load efficiency. In addition, the driver IC supports ULQ mode that enables connected standby for Windows 8. With the PWM input in tri-state, quiescent current is reduced to 130 µA, with immediate response. When SKIP# is held at tri-state, the current is reduced to 8 µA (typically 20 µs is required to resume switching). This combination produces a high current, high efficiency, and high speed switching device in a small 3.5 × 4.5 mm outline package. In addition, the PCB footprint is optimized to help reduce design time and simplify the completion of the overall system design.

Download View video with transcript Video

Similar products you might be interested in

open-in-new Compare alternates
Drop-in replacement with upgraded functionality to the compared device
CSD97394Q4M ACTIVE CSD97394Q4M Synchronous Buck NexFET™ Power Stage Identical parts

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 1
Type Title Date
* Data sheet CSD97396Q4M Synchronous Buck NexFET™ Power Stage datasheet PDF | HTML 10 Dec 2015

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Simulation model

CSD97396Q4M PSpice Transient Model

SLPM295.ZIP (44 KB) - PSpice Model
Package Pins CAD symbols, footprints & 3D models
VSON-CLIP (DPC) 8 Ultra Librarian

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos