Product details

Configuration 8:1 Number of channels 1 Power supply voltage - single (V) 12, 16, 20, 36, 44 Power supply voltage - dual (V) +/-10, +/-15, +/-18, +/-22, +/-5 Protocols Analog Ron (typ) (Ω) 4 CON (typ) (pF) 185 ON-state leakage current (max) (µA) 0.04 Supply current (typ) (µA) 3 Bandwidth (MHz) 30 Operating temperature range (°C) -40 to 125 Features 1.8-V compatible control inputs, Break-before-make, Fail-safe logic Input/output continuous current (max) (mA) 300 Rating Catalog Drain supply voltage (max) (V) 22 Supply voltage (max) (V) 44 Negative rail supply voltage (max) (V) -4.5
Configuration 8:1 Number of channels 1 Power supply voltage - single (V) 12, 16, 20, 36, 44 Power supply voltage - dual (V) +/-10, +/-15, +/-18, +/-22, +/-5 Protocols Analog Ron (typ) (Ω) 4 CON (typ) (pF) 185 ON-state leakage current (max) (µA) 0.04 Supply current (typ) (µA) 3 Bandwidth (MHz) 30 Operating temperature range (°C) -40 to 125 Features 1.8-V compatible control inputs, Break-before-make, Fail-safe logic Input/output continuous current (max) (mA) 300 Rating Catalog Drain supply voltage (max) (V) 22 Supply voltage (max) (V) 44 Negative rail supply voltage (max) (V) -4.5
TSSOP (PW) 16 32 mm² 5 x 6.4 WQFN (RUM) 16 16 mm² 4 x 4
  • Latch-up immune
  • Dual supply range: ±4.5V to ±22V
  • Single supply range: 4.5V to 44V
  • Low on-resistance: 4Ω
  • Low charge injection: 3pC
  • High current support: 400mA (maximum) (WQFN)
  • High current support: 300mA (maximum) (TSSOP)
  • –40°C to +125°C operating temperature
  • 1.8V logic compatible inputs
  • Integrated pull-down resistor on logic pins
  • Fail-safe logic
  • Rail-to-rail operation
  • Bidirectional signal path
  • Break-before-make switching
  • Latch-up immune
  • Dual supply range: ±4.5V to ±22V
  • Single supply range: 4.5V to 44V
  • Low on-resistance: 4Ω
  • Low charge injection: 3pC
  • High current support: 400mA (maximum) (WQFN)
  • High current support: 300mA (maximum) (TSSOP)
  • –40°C to +125°C operating temperature
  • 1.8V logic compatible inputs
  • Integrated pull-down resistor on logic pins
  • Fail-safe logic
  • Rail-to-rail operation
  • Bidirectional signal path
  • Break-before-make switching

The TMUX7208 is a precision 8:1, single channel multiplexer while the TMUX7209 is a 4:1, 2 channel multiplexer featuring low on resistance and charge injection. The devices work with a single supply (4.5V to 44V), dual supplies (±4.5V to ±22V), or asymmetric supplies (such as VDD = 12V, VSS = –5V). The TMUX720x support bidirectional analog and digital signals on the source (Sx) and drain (D) pins ranging from VSS to VDD.

The TMUX720x are part of the precision switches and multiplexers family of devices and have very low on and off leakage currents allowing them to be used in high precision measurement applications. The TMUX720x family provides latch-up immunity, preventing undesirable high current events between parasitic structures within the device typically caused by overvoltage events. A latch-up condition typically continues until the power supply rails are turned off and can lead to device failure. The latch-up immunity feature allows the TMUX720x family of switches and multiplexers to be used in harsh environments.

The TMUX7208 is a precision 8:1, single channel multiplexer while the TMUX7209 is a 4:1, 2 channel multiplexer featuring low on resistance and charge injection. The devices work with a single supply (4.5V to 44V), dual supplies (±4.5V to ±22V), or asymmetric supplies (such as VDD = 12V, VSS = –5V). The TMUX720x support bidirectional analog and digital signals on the source (Sx) and drain (D) pins ranging from VSS to VDD.

The TMUX720x are part of the precision switches and multiplexers family of devices and have very low on and off leakage currents allowing them to be used in high precision measurement applications. The TMUX720x family provides latch-up immunity, preventing undesirable high current events between parasitic structures within the device typically caused by overvoltage events. A latch-up condition typically continues until the power supply rails are turned off and can lead to device failure. The latch-up immunity feature allows the TMUX720x family of switches and multiplexers to be used in harsh environments.

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Technical documentation

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Type Title Date
* Data sheet TMUX720x 44V, Latch-Up Immune, 8:1, 1-Channel and 4:1, 2-Channel Precision Multiplexers with 1.8V Logic datasheet (Rev. F) PDF | HTML 11 Jul 2024
Application note How to Handle High Voltage Common Mode Applications using Multiplexers PDF | HTML 03 Oct 2022
Product overview PLC Analog Input Front-End Architectures PDF | HTML 31 Jul 2022
Application note Guarding in Multiplexer Applications PDF | HTML 13 May 2022
Application note Using Latch Up Immune Multiplexers to Help Improve System Reliability (Rev. A) 20 Sep 2021
Application brief Precision Multiplexers Reducing Barriers in an Industrial Environment PDF | HTML 21 May 2021
User guide TMUX7208 Evaluation Module (Rev. A) PDF | HTML 23 Dec 2020
Certificate TMUX7208EVM EU RoHS Declaration of Conformity (DoC) 18 Dec 2020

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

TMUX7208EVM — TMUX7208 PW package evaluation module

The TMUX7208EVM supports evaluation of the TMUX7208 devices in the 16-pin TSSOP (PW) package. This evaluation module can be used for quick prototyping and testing of the TMUX7208 devices specifically for DC and timing parameters.

User guide: PDF | HTML
Not available on TI.com
Evaluation board

TMUXRUM-RRPEVM — TMUX generic evaluation module for 16-pin RUM and RRP quad-flatpack no-lead (QFN) packages

The TMUXRUM-RRPEVM allows for the quick prototyping and DC characterization of  the TI line of TMUX products that use 16-pin RUM or RRP packages (QFN) and is rated for high-voltage operation.

User guide: PDF | HTML
Not available on TI.com
Interface adapter

LEADED-ADAPTER1 — Surface mount to DIP header adapter for quick testing of TI's 5, 8, 10, 16 & 24-pin leaded packages

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

User guide: PDF
Not available on TI.com
Simulation model

TMUX7208 IBIS Model

SCDM248.ZIP (238 KB) - IBIS Model
Simulation model

TMUX7208 Pspice Model

SCDM291.ZIP (234 KB) - PSpice Model
Package Pins CAD symbols, footprints & 3D models
TSSOP (PW) 16 Ultra Librarian
WQFN (RUM) 16 Ultra Librarian

Ordering & quality

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Information included:
  • Fab location
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