The TMUX7212 is a complementary metal-oxide semiconductor (CMOS) switch with four independently selectable 1:1, single-pole, single-throw (SPST) switch channels. This device works with a single supply (4.5V to 44V), dual supplies (±4.5V to ±22V), or asymmetric supplies (such as VDD = 12V, VSS = –5V). The TMUX721x supports bidirectional analog and digital signals on the source (Sx) and drain (Dx) pins ranging from VSS to VDD.
The switches of the TMUX721x are controlled with appropriate logic control inputs on the SELx pins. The TMUX721x is part of the precision switches and multiplexers family of devices and has very low on and off leakage currents allowing them to be used in high precision measurement applications.
The TMUX721x provides latch-up immunity, preventing undesirable high current events between parasitic structures within the device typically caused by overvoltage events. A latch-up condition typically continues until the power supply rails are turned off and can lead to device failure. The latch-up immunity feature allows the TMUX721x to be used in harsh environments.
| Type | Title | Date | ||
|---|---|---|---|---|
| * | Data sheet | TMUX721x 44V , Low-RON, 1:1 (SPST), 4-Channel Precision Switches with Latch-Up Immunity and 1.8-V Logic datasheet (Rev. D) | PDF | HTML | 10 Jul 2024 |
| Application note | Guarding in Multiplexer Applications | PDF | HTML | 13 May 2022 | |
| Application note | Using Latch Up Immune Multiplexers to Help Improve System Reliability (Rev. A) | 20 Sep 2021 | ||
| EVM User's guide | TMUX721xEVM Evaluation Module | 23 Dec 2020 | ||
| Certificate | TMUX7211EVM EU RoHS Declaration of Conformity (DoC) (Rev. A) | 08 Dec 2020 |
For additional terms or required resources, click any title below to view the detail page where available.
The TMUX721xEVM supports evaluation of the TMUX721x devices in the 16-pin TSSOP (PW) package including TMUX7211PWR, TMUX7212PWR and TMUX7213PWR. This evaluation module can be used for quick prototyping and testing of the TMUX721x devices specifically for DC and timing parameters.
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
| Package | Pins | CAD symbols, footprints & 3D models |
|---|---|---|
| TSSOP (PW) | 16 | Ultra Librarian |
| WQFN (RUM) | 16 | Ultra Librarian |
Recommended products may have parameters, evaluation modules or reference designs related to this TI product.
Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.
If you have questions about quality, packaging or ordering TI products, see TI support.