The TMUX7219-Q1 is a complementary metal-oxide semiconductor (CMOS) switch with latch-up immunity in a single channel, 2:1 (SPDT) configuration. The device works with a single supply (4.5 V to 44 V), dual supplies (±4.5V to ±22V), or asymmetric supplies (such as VDD = 12V, VSS = –5V). The TMUX7219-Q1 supports bidirectional analog and digital signals on the source (Sx) and drain (D) pins ranging from VSS to VDD.
The TMUX7219-Q1 can be enabled or disabled by controlling the EN pin. When disabled, both signal path switches are off. When enabled, the SEL pin can be used to turn on signal path 1 (S1 to D) or signal path 2 (S2 to D). All logic control inputs support logic levels from 1.8V to VDD, ensuring both TTL and CMOS logic compatibility when operating in the valid supply voltage range. Fail-Safe Logic circuitry allows voltages on the control pins to be applied before the supply pin, protecting the device from potential damage.
The TMUX72xx family provides latch-up immunity, preventing undesirable high current events between parasitic structures within the device typically caused by overvoltage events. A latch-up condition typically continues until the power supply rails are turned off and can lead to device failure. The latch-up immunity feature allows the TMUX72xx family of switches and multiplexers to be used in harsh environments.
| Type | Title | Date | ||
|---|---|---|---|---|
| * | Data sheet | TMUX7219-Q1 44V , Latch-Up Immune, 2:1 (SPDT) Precision Switch with 1.8V Logic datasheet (Rev. B) | PDF | HTML | 10 Jul 2024 |
| Application note | How to Handle High Voltage Common Mode Applications using Multiplexers | PDF | HTML | 03 Oct 2022 | |
| Application note | Using Latch Up Immune Multiplexers to Help Improve System Reliability (Rev. A) | 20 Sep 2021 | ||
| Functional safety information | TMUX7219-Q1 Functional Safety, FIT Rate, Failure Mode Distribution and Pin FMA | PDF | HTML | 14 Jun 2021 |
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The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
| Package | Pins | CAD symbols, footprints & 3D models |
|---|---|---|
| VSSOP (DGK) | 8 | Ultra Librarian |
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